发明授权
- 专利标题: Surface coating for electronic systems
- 专利标题(中): 电子系统表面涂层
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申请号: US13447456申请日: 2012-04-16
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公开(公告)号: US08685529B1公开(公告)日: 2014-04-01
- 发明人: Junghyun Cho , Scott Oliver , Wayne Jones , Bahgat Sammakia
- 申请人: Junghyun Cho , Scott Oliver , Wayne Jones , Bahgat Sammakia
- 申请人地址: US NY Binghamton
- 专利权人: The Research Foundation for The State University of New York
- 当前专利权人: The Research Foundation for The State University of New York
- 当前专利权人地址: US NY Binghamton
- 代理机构: Ostrolenk Faber LLP
- 代理商 Steven M. Hoffberg
- 主分类号: B32B27/00
- IPC分类号: B32B27/00 ; B41M5/52 ; B32B27/08 ; H05K1/03 ; H05K3/46 ; C04B41/87 ; C04B41/89
摘要:
A method for coating for a substrate, comprising applying an underlayer of a self assembling monolayer well ordered array of long chain molecules on the substrate; and applying a top layer, over the underlayer, wherein the self-assembling monolayer well ordered array serves as a molecular template organizing formation of said top layer, comprising at least one of a thermally-resistant polymer layer over said self assembling monolayer selected from the group consisting of epoxies, and phosphorus-based polyimides; and a metal oxide, metal nitride, or a ceramic. The self assembling monolayer may be selectively applied to a portion of the substrate, leaving an uncoated region, and the top layer formed only over the areas of the substrate coated with the self-assembling monolayer, resulting in at least one region of the substrate which is not coated with the top layer.
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