Invention Grant
- Patent Title: Block composites in soft compounds
- Patent Title (中): 软化合物中的嵌段复合材料
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Application No.: US12896553Application Date: 2010-10-01
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Publication No.: US08686087B2Publication Date: 2014-04-01
- Inventor: Colin Li Pi Shan , Kim L. Walton , Gary R. Marchand , Ashish Batra , Eddy I. Garcia-Meitin , Jeffrey D. Weinhold
- Applicant: Colin Li Pi Shan , Kim L. Walton , Gary R. Marchand , Ashish Batra , Eddy I. Garcia-Meitin , Jeffrey D. Weinhold
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Main IPC: C08L53/00
- IPC: C08L53/00
Abstract:
Embodiments of the invention provide block composites and their use in soft compounds.
Public/Granted literature
- US20110082249A1 BLOCK COMPOSITES IN SOFT COMPOUNDS Public/Granted day:2011-04-07
Information query
