Invention Grant
US08686450B2 Method of manufacturing a vertically-structured GaN-based light emitting diode
有权
制造垂直结构的GaN基发光二极管的方法
- Patent Title: Method of manufacturing a vertically-structured GaN-based light emitting diode
- Patent Title (中): 制造垂直结构的GaN基发光二极管的方法
-
Application No.: US11892445Application Date: 2007-08-23
-
Publication No.: US08686450B2Publication Date: 2014-04-01
- Inventor: Jae Hoon Lee , Hee Seok Choi , Jeong Tak Oh , Su Yeol Lee
- Applicant: Jae Hoon Lee , Hee Seok Choi , Jeong Tak Oh , Su Yeol Lee
- Applicant Address: KR Seoul
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2005-0039076 20050510
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
The present invention relates to a method of manufacturing a vertically-structured GaN-based light emitting diode. The method of manufacturing a vertically-structured GaN-based light emitting diode includes forming a GaN layer on a substrate; patterning the compound layer in a predetermined shape; forming an n-type GaN layer on the patterned compound layer through the epitaxial lateral over-growth process and sequentially forming an active layer and a p-type GaN layer on the n-type GaN layer; forming a structure supporting layer on the p-type GaN layer; sequentially removing the substrate and the GaN layer formed on the substrate after forming the structure supporting layer; removing the patterned compound layer exposed after removing the GaN layer so as to form an n-type GaN layer patterned in a concave shape; and forming an n-type electrode on the n-type GaN layer patterned in a concave shape.
Public/Granted literature
- US20070290225A1 Method of manufacturing a vertically-structured GaN-based light emitting diode Public/Granted day:2007-12-20
Information query
IPC分类: