The package substrate includes a core, a plurality of first circuit segments, and a plurality of conductive pillars. Each of the first circuit segments has a patterned metal layer disposed on the core, a barrier layer disposed on the patterned metal layer, and an upper metal pattern disposed on the barrier layer. The conductive pillars penetrate the core, the patterned metal layer, and the barrier layer, and contact the upper metal pattern. The conductive pillars are formed from a material that can be selectively removed without affecting the barrier layer.