公开(公告)号：US10049976B2

公开(公告)日：2018-08-14

申请号：US15006306

申请日：2016-01-26

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Tien-Szu Chen ,  Chun-Che Lee ,  Sheng-Ming Wang ,  Kuang-Hsiung Chen ,  Yu-Ying Lee

IPC分类号： H01L23/498 ,  H01L21/48

摘要： A semiconductor substrate includes an insulating layer and a conductive circuit layer embedded at a surface of the insulating layer. The conductive circuit layer includes a first portion and a second portion. The first portion includes a bonding pad and one portion of a conductive trace, and the second portion includes another portion of the conductive trace. An upper surface of the first portion is not coplanar with an upper surface of the second portion. A semiconductor packaging structure includes the semiconductor substrate.

公开(公告)号：US20160079194A1

公开(公告)日：2016-03-17

申请号：US14855849

申请日：2015-09-16

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Tien-Szu Chen ,  Sheng-Ming Wang ,  Kuang-Hsiung Chen ,  Yu-Ying Lee

IPC分类号： H01L23/00 ,  H01L23/522 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L24/14 ,  H01L21/4846 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/13 ,  H01L2224/13012 ,  H01L2224/13025 ,  H01L2224/1412 ,  H01L2224/73204 ,  H01L2924/15313 ,  H01L2924/3512

摘要： A semiconductor substrate includes an insulating layer, a first conductive patterned layer disposed adjacent to a first surface of the insulating layer, and conductive bumps disposed on the first conductive patterned layer. Each conductive bump has a first dimension along a first direction and a second dimension along a second direction perpendicular to the first direction, and the first dimension is greater than the second dimension. A semiconductor package structure includes the semiconductor substrate, at least one die electrically connected to the conductive bumps, and a molding compound encapsulating the conductive bumps.

摘要翻译： 半导体衬底包括绝缘层，邻近绝缘层的第一表面设置的第一导电图案层和设置在第一导电图案层上的导电凸块。 每个导电凸块具有沿着第一方向的第一尺寸和沿着垂直于第一方向的第二方向的第二尺寸，并且第一尺寸大于第二尺寸。 半导体封装结构包括半导体衬底，至少一个与导电凸块电连接的管芯，以及封装导电凸块的模制化合物。

公开(公告)号：US20140084475A1

公开(公告)日：2014-03-27

申请号：US13624548

申请日：2012-09-21

申请人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.

发明人： Tien-Szu Chen ,  Kuang-Hsiung Chen ,  Sheng-Ming Wang ,  Hsiang-Ming Feng ,  Yen-Hua Kuo

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/49827 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/11462 ,  H01L2224/13018 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1401 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/4007 ,  H05K2201/0367 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The substrate includes a first dielectric layer, a first circuit pattern, a plurality of pillars and a second circuit pattern. The first dielectric layer has opposing first and second dielectric surfaces. The first circuit pattern is embedded in the first dielectric layer and defines a plurality of curved trace surfaces. Each of the pillars has an exterior surface adapted for making external electrical connection and a curved base surface abutting a corresponding one of the trace surfaces. The second circuit pattern is on the second dielectric surface of the first dielectric layer and electrically connected to the first circuit pattern.

摘要翻译： 衬底包括第一介电层，第一电路图案，多个柱和第二电路图案。 第一电介质层具有相对的第一和第二电介质表面。 第一电路图案嵌入在第一电介质层中并且限定多个弯曲迹线表面。 每个支柱具有适于制造外部电连接的外表面和与相应的一个轨迹表面邻接的弯曲基底表面。 第二电路图案在第一电介质层的第二电介质表面上并且电连接到第一电路图案。

公开(公告)号：US11894308B2

公开(公告)日：2024-02-06

申请号：US17109111

申请日：2020-12-01

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Sheng-Ming Wang ,  Tien-Szu Chen ,  Wen-Chih Shen ,  Hsing-Wen Lee ,  Hsiang-Ming Feng

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L23/66 ,  H01L23/367 ,  H01P3/06 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/5386 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3677 ,  H01L23/5383 ,  H01L23/66 ,  H01P3/06 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48225 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105

摘要： The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.

公开(公告)号：US10734337B2

公开(公告)日：2020-08-04

申请号：US16293606

申请日：2019-03-05

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Kuang-Hsiung Chen ,  Yu-Hsuan Tsai ,  Yu-Ying Lee ,  Sheng-Ming Wang ,  Wun-Jheng Syu

IPC分类号： H01L23/28 ,  H01L23/00 ,  B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

摘要： A micro-electromechanical systems (MEMS) package structure includes: (1) a circuit layer; (2) a MEMS die with an active surface, wherein the active surface faces the circuit layer; (3) a conductive pillar adjacent to the MEMS die; and (4) a package body encapsulating the MEMS die and the conductive pillar, and exposing a top surface of the conductive pillar.

公开(公告)号：US10224298B2

公开(公告)日：2019-03-05

申请号：US15649474

申请日：2017-07-13

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Kuang-Hsiung Chen ,  Yu-Hsuan Tsai ,  Yu-Ying Lee ,  Sheng-Ming Wang ,  Wun-Jheng Syu

IPC分类号： H01L23/28 ,  H01L23/00 ,  B81B7/00 ,  B81C1/00 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

摘要： In one or more embodiments, a micro-electromechanical systems (MEMS) package structure comprises a MEMS die, a conductive pillar adjacent to the MEMS die, a package body and a binding layer on the package body. The package body encapsulates the MEMS die and the conductive pillar, and exposes a top surface of the conductive pillar. A glass transition temperature (Tg) of the package body is greater than a temperature for forming the binding layer (Tc).

公开(公告)号：US10157887B2

公开(公告)日：2018-12-18

申请号：US15454520

申请日：2017-03-09

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Tien-Szu Chen ,  Kuang-Hsiung Chen ,  Sheng-Ming Wang ,  I-Cheng Wang ,  Wun-Jheng Syu

IPC分类号： H01L23/28 ,  H01L23/48 ,  H01L23/528 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/29 ,  H01L23/24 ,  H01L25/00 ,  H01L21/48

摘要： A semiconductor device package includes a first circuit layer, at least one electrical element, a first molding layer, an electronic component and a second molding layer. The at least one electrical element is disposed over a first surface of the first circuit layer and electrically connected to the first circuit layer. The first molding layer is disposed over the first surface of the first circuit layer. The first molding layer encapsulates an edge of the at least one electrical element, and a lower surface of the first molding layer and a lower surface of the at least one electrical element are substantially coplanar. The electronic component is disposed over a second surface of the first circuit layer and is electrically connected to the first circuit layer. The second molding layer is disposed over the second surface of the first circuit layer and encapsulates the electronic component.

公开(公告)号：US09224707B2

公开(公告)日：2015-12-29

申请号：US14509320

申请日：2014-10-08

申请人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.

发明人： Tien-Szu Chen ,  Chun-Che Lee ,  Sheng-Ming Wang

IPC分类号： H01L23/00 ,  H01L23/48 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H05K3/40 ,  H01L23/13

CPC分类号： H01L23/49811 ,  H01L21/0273 ,  H01L21/48 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/768 ,  H01L23/13 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13005 ,  H01L2224/13013 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/14131 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved.

摘要翻译： 半导体封装基板包括芯部，上电路层和多个支柱。 支柱设置在上电路层上并从上电路层向上突出。 支柱的顶面基本上共面。 支柱提供与半导体管芯的电互连。 提高了基板与半导体管芯之间的焊接可靠性。

公开(公告)号：US20150021766A1

公开(公告)日：2015-01-22

申请号：US14509320

申请日：2014-10-08

申请人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.

发明人： Tien-Szu Chen ,  Chun-Che Lee ,  Sheng-Ming Wang

IPC分类号： H01L23/00

CPC分类号： H01L23/49811 ,  H01L21/0273 ,  H01L21/48 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/768 ,  H01L23/13 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13005 ,  H01L2224/13013 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/14131 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved.

摘要翻译： 半导体封装基板包括芯部，上电路层和多个支柱。 支柱设置在上电路层上并向上突出。 支柱的顶面基本上共面。 支柱提供与半导体管芯的电互连。 提高了基板与半导体管芯之间的焊接可靠性。

公开(公告)号：US10854550B2

公开(公告)日：2020-12-01

申请号：US16109272

申请日：2018-08-22

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Sheng-Ming Wang ,  Tien-Szu Chen ,  Wen-Chih Shen ,  Hsing-Wen Lee ,  Hsiang-Ming Feng

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L23/66 ,  H01L23/367 ,  H01P3/06 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065

摘要： The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.