Invention Grant
- Patent Title: Card structure, socket structure, and assembly structure thereof
- Patent Title (中): 卡结构,插座结构及其组装结构
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Application No.: US12759671Application Date: 2010-04-13
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Publication No.: US08687373B2Publication Date: 2014-04-01
- Inventor: Chih-Yuan Liu , Chien-Hong Lin , Yuan-Heng Sun
- Applicant: Chih-Yuan Liu , Chien-Hong Lin , Yuan-Heng Sun
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW98136426A 20091028
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H05K1/00

Abstract:
A card structure includes a first element and a second element. The first element includes a first peripheral portion and a plurality of first contact points exposed by the first peripheral portion. The second element includes a second peripheral portion and a plurality of second contact points corresponding to the first contact points of the first element and exposed by the second peripheral portion. When the first and second elements are joined with each other, the first peripheral portion of the first element and the second peripheral portion of the second element are adjacent to each other, to juxtapose the first contact points of the first element and the second contact points of the second element to each other. The juxtaposed first and second contact points of the first and second elements are coupled to each other by a welding portion.
Public/Granted literature
- US20100321905A1 CARD STRUCTURE, SOCKET STRUCTURE, AND ASSEMBLY STRUCTURE THEREOF Public/Granted day:2010-12-23
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