Invention Grant
- Patent Title: Multiple tools using a single data processing unit
- Patent Title (中): 使用单个数据处理单元的多种工具
-
Application No.: US11871360Application Date: 2007-10-12
-
Publication No.: US08688254B2Publication Date: 2014-04-01
- Inventor: Burn Jeng Lin
- Applicant: Burn Jeng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B05B5/025 ; B05C5/00 ; B05C9/08 ; B05C11/00 ; C23C14/30 ; H05B7/00
Abstract:
A method and system for simultaneously processing multiple substrates through an imaging beam process is provided. The system includes a plurality of direct write substrate exposure modules configured to receive a writing instruction from a data processing unit. The system and method of the invention utilizes multiple exposure modules receiving writing instructions from a single common data processing unit.
Public/Granted literature
- US20080311314A1 MULTIPLE TOOLS USING A SINGLE DATA PROCESSING UNIT Public/Granted day:2008-12-18
Information query
