Invention Grant
- Patent Title: Method for manufacturing photoelectric conversion device
- Patent Title (中): 制造光电转换装置的方法
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Application No.: US13877148Application Date: 2011-08-31
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Publication No.: US08691613B2Publication Date: 2014-04-08
- Inventor: Masashi Yoshimi , Mitsuru Ichikawa , Toshihiko Uto , Kenji Yamamoto
- Applicant: Masashi Yoshimi , Mitsuru Ichikawa , Toshihiko Uto , Kenji Yamamoto
- Applicant Address: JP Osaka
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka
- Agency: Alleman Hall McCoy Russell & Tuttle LLP
- Priority: JP2010-224118 20101001
- International Application: PCT/JP2011/069811 WO 20110831
- International Announcement: WO2012/043124 WO 20120405
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A crystalline-based silicon photoelectric conversion device comprises: an intrinsic silicon-based layer and a silicon-based layer of a first conductivity type, on one surface of a single-crystal silicon substrate of the first conductivity type; and an intrinsic silicon-based and a silicon-based layer of an opposite conductivity type, in this order on the other surface of the silicon substrate. At least one of forming the intrinsic silicon-based layer of the first conductivity type layer-side forming the intrinsic silicon-based layer of the opposite conductivity type layer-side includes: forming a first intrinsic silicon-based thin-film layer having a thickness of 1-10 nm on the silicon substrate; plasma-treating the silicon substrate in a gas containing mainly hydrogen; and forming a second intrinsic silicon-based thin-film layer on the first intrinsic silicon-based thin-film.
Public/Granted literature
- US20130210185A1 METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE Public/Granted day:2013-08-15
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