发明授权
- 专利标题： Dicing tape-integrated film for semiconductor back surface
- 专利标题（中）： 用于半导体背面的切割胶带一体化膜
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申请号： US12976112申请日： 2010-12-22
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公开(公告)号： US08692389B2公开(公告)日： 2014-04-08
- 发明人: Naohide Takamoto , Takeshi Matsumura , Goji Shiga
- 申请人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2009-292769 20091224; JP2010-253088 20101111
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.
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