Invention Grant
US08694276B2 Built-in self-test methods, circuits and apparatus for concurrent test of RF modules with a dynamically configurable test structure
有权
内置自检方法,电路和设备,用于通过动态配置的测试结构对射频模块进行并发测试
- Patent Title: Built-in self-test methods, circuits and apparatus for concurrent test of RF modules with a dynamically configurable test structure
- Patent Title (中): 内置自检方法,电路和设备,用于通过动态配置的测试结构对射频模块进行并发测试
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Application No.: US13042849Application Date: 2011-03-08
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Publication No.: US08694276B2Publication Date: 2014-04-08
- Inventor: Adesh Sharadrao Sontakke , Rajesh Kumar Mittal , Rubin A. Parekhji , Upendra Narayan Tripathi
- Applicant: Adesh Sharadrao Sontakke , Rajesh Kumar Mittal , Rubin A. Parekhji , Upendra Narayan Tripathi
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Wade J. Brady, III; Frederick J. Telecky, Jr.
- Priority: IN191/CHE/2011 20110120
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A testable integrated circuit chip (80, 100) includes a functional circuit (80) having modules (IP.i), a storage circuit (110) operable to hold a table representing sets of compatible tests that are compatible for concurrence, and an on-chip test controller (140, 150) coupled with said storage circuit (110) and with said functional circuit modules (IP.i), said test controller (140, 150) operable to dynamically schedule and trigger the tests in those sets, whereby promoting concurrent execution of tests in said functional circuit modules (IP.i). Other circuits, wireless chips, systems, and processes of operation and processes of manufacture are disclosed.
Public/Granted literature
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