Invention Grant
US08698201B1 Gate metallization methods for self-aligned sidewall gate GaN HEMT
有权
用于自对准侧壁栅极GaN HEMT的栅极金属化方法
- Patent Title: Gate metallization methods for self-aligned sidewall gate GaN HEMT
- Patent Title (中): 用于自对准侧壁栅极GaN HEMT的栅极金属化方法
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Application No.: US13968185Application Date: 2013-08-15
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Publication No.: US08698201B1Publication Date: 2014-04-15
- Inventor: Dean C. Regan , Keisuke Shinohara , Andrea Corrion , Ivan Milosavljevic , Miroslav Micovic , Peter J. Willadsen , Colleen M. Butler , Hector L. Bracamontes , Bruce T. Holden , David T. Chang
- Applicant: HRL Laboratories, LLC
- Applicant Address: US CA Malibu
- Assignee: HRL Laboratories, LLC
- Current Assignee: HRL Laboratories, LLC
- Current Assignee Address: US CA Malibu
- Agency: Ladas & Parry
- Main IPC: H01L29/205
- IPC: H01L29/205

Abstract:
A method for fabricating a gate structure for a field effect transistor having a buffer layer on a substrate, a channel layer and a barrier layer over the channel layer includes forming a gate of a first dielectric, forming first sidewalls of a second dielectric on either side and adjacent to the gate, selectively etching into the buffer layer to form a mesa for the field effect transistor, depositing a dielectric layer over the mesa, planarizing the dielectric layer over the mesa to form a planarized surface such that a top of the gate, tops of the first sidewalls, and a top of the dielectric layer over the mesa are on the same planarized surface, depositing metal on the planzarized surface, annealing to form the gate into a metal silicided gate, and etching to remove excess non-silicided metal.
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