Invention Grant
- Patent Title: Dicing tape-integrated film for semiconductor back surface
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Application No.: US12975641Application Date: 2010-12-22
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Publication No.: US08698324B2Publication Date: 2014-04-15
- Inventor: Naohide Takamoto , Takeshi Matsumura , Goji Shiga
- Applicant: Naohide Takamoto , Takeshi Matsumura , Goji Shiga
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-292770 20091224; JP2010-253091 20101111
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/50
Abstract:
The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.
Public/Granted literature
- US09035466B2 Dicing tape-integrated film for semiconductor back surface Public/Granted day:2015-05-19
Information query
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