Invention Grant
- Patent Title: Probe and method of manufacturing probe
- Patent Title (中): 探头和探头的制造方法
-
Application No.: US14053747Application Date: 2013-10-15
-
Publication No.: US08698513B2Publication Date: 2014-04-15
- Inventor: Koki Sato , Koki Takahashi
- Applicant: Fujitsu Component Limited
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2010-096111 20100419
- Main IPC: G01R31/00
- IPC: G01R31/00 ; B21D31/00

Abstract:
A probe used for electrical measurement includes first and second internal electrically-conductive parts; first and second terminal contact parts configured to contact first and second external electrode terminals, respectively; first and second spring parts each having a meandering pattern; a housing part configured to surround the first and second internal electrically-conductive parts. The first internal electrically-conductive part, the first terminal contact part, the first spring part, the housing part, the second spring part, the second terminal contact part, and the second internal electrically-conductive part are successively connected in a single metal plate from a first end to a second end thereof. The first and second terminal contact parts are in first and second bent portions, respectively, of the single metal plate. The first and second internal electrically-conductive parts are configured to contact each other at the time of performing the electrical measurement.
Public/Granted literature
- US20140033792A1 PROBE AND METHOD OF MANUFACTURING PROBE Public/Granted day:2014-02-06
Information query