发明授权
- 专利标题: Three-dimensional microstructures
- 专利标题(中): 三维微结构
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申请号: US13176740申请日: 2011-07-05
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公开(公告)号: US08698577B2公开(公告)日: 2014-04-15
- 发明人: David Sherrer , Jean-Marc Rollin , Kenneth Vanhille , Marcus Oliver , Steve Huettner
- 申请人: David Sherrer , Jean-Marc Rollin , Kenneth Vanhille , Marcus Oliver , Steve Huettner
- 申请人地址: US VA Radford
- 专利权人: Nuvotronics, LLC
- 当前专利权人: Nuvotronics, LLC
- 当前专利权人地址: US VA Radford
- 代理机构: Dann, Dorfman, Herrell & Skillman, P.C.
- 代理商 Niels Haun
- 主分类号: H01P3/08
- IPC分类号: H01P3/08
摘要:
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
公开/授权文献
- US20120062335A1 THREE-DIMENSIONAL MICROSTRUCTURES 公开/授权日:2012-03-15
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