Invention Grant
- Patent Title: Antenna with improved holed system ground plane
- Patent Title (中): 天线具有改进的带孔系统接地层
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Application No.: US13153142Application Date: 2011-06-03
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Publication No.: US08698688B2Publication Date: 2014-04-15
- Inventor: Tsung-Wen Chiu , Fu-Ren Hsiao
- Applicant: Tsung-Wen Chiu , Fu-Ren Hsiao
- Applicant Address: TW Taipei County
- Assignee: Advanced Connectek, Inc.
- Current Assignee: Advanced Connectek, Inc.
- Current Assignee Address: TW Taipei County
- Agency: Schmeiser, Olsen & Watts LLP
- Priority: TW99146901A 20101230
- Main IPC: H01Q1/48
- IPC: H01Q1/48

Abstract:
An antenna with an improved holed system ground plane comprises a substrate, a radiation conductor member, a grounding member and a system ground plane. The radiation conductor member is arranged on the surface of the substrate. The grounding member is arranged on one edge of the substrate. The radiation conductor member is connected with the grounding member. The system ground plane is connected with one side of the grounding member. The system ground plane has at least one arbitrary-shaped hole. A radiation-enhancing filler is disposed in the arbitrary-shaped hole. The present invention solves the conventional problems that the system ground plane is drilled or cut to accommodate components and IC chips, keep away from wiring routes and avoid protrusions on the appearance, via disposing radiation-enhancing fillers in the arbitrary-shaped holes. Thereby is kept integrality of the system ground plane and promoted omnidirectionality of signal transmission.
Public/Granted literature
- US20120169564A1 Antenna With Improved Holed System Ground Plane Public/Granted day:2012-07-05
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