发明授权
US08704313B1 Low capacitance, low on resistance ESD diode 失效
低电容,低导通电阻ESD二极管

Low capacitance, low on resistance ESD diode
摘要:
An electrostatic discharge (ESD) protection structure comprising a polysilicon gate on an insulating layer on a substrate, said gate having first and second sides, a first heavily doped P-region in the substrate on the first side of the gate, a first heavily doped N-region in the substrate on the second side of the gate, and a shallow trench isolation isolating said first P-region and said first N-region from other structures in the substrate. In a first embodiment, the heavily doped regions are formed in a well having opposite conductivity to that of the substrate and a diode is formed at a PN junction between one of the heavily doped regions and the well. To minimize capacitance between the well and the substrate, the substrate is doped at a level of native doping and the well is isolated so that no other wells or heavily-doped regions are nearby in the substrate. Doping levels in the well and the dimensions of the gate are controlled to minimize on resistance (Ron) of the diode. In a second embodiment, no well is used.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/76 ...单极器件
H01L29/772 ....场效应晶体管
H01L29/78 .....由绝缘栅产生场效应的
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