摘要:
Memory elements are provided that exhibit immunity to soft error upset events when subjected to radiation strikes such as high-energy atomic particle strikes. Each memory element may each have four inverter-like transistor pairs that form a bistable element, a pair of address transistors, and a pair of relatively weak transistors connected between two of the inverters that create a common output node which is resistant to rapid changes to its state. The transistors may be connected in a pattern that forms a bistable memory element that is resistant to soft error upset events due to radiation strikes. Data may be loaded into and read out of the memory element using the address transistor pair.
摘要:
Integrated circuits are provided with circuitry such as multiplexers that can be selectively configured to route different adjustable power supply voltages to different circuit blocks on the integrated circuits. The circuit blocks may contain memory elements that are powered by the power supply voltages and that provide corresponding static output control signals at magnitudes that are determined by the power supply voltages. The control signals from the memory elements may be applied to the gates of transistors in the circuit blocks. Logic on an integrated circuit may be powered at a given power supply voltage level. The memory elements may provide their output signals at overdrive voltage levels that are elevated with respect to the given power supply voltage level. Memory elements associated with circuit blocks that contain critical paths can be overdriven at voltages that are larger than memory elements associated with circuit blocks that contain noncritical paths.
摘要:
An apparatus includes a temperature sensor, a voltage regulator, and a field programmable gate array (FPGA). The temperature sensor and the voltage regulator are adapted, respectively, to provide a temperature signal, and to provide at least one output voltage. The FPGA includes at least one circuit adapted to receive the at least one output voltage of the voltage regulator, and a set of monitor circuits adapted to provide indications of process and temperature for the at least one circuit. The FPGA further includes a controller adapted to derive a body-bias signal and a voltage-level signal from the temperature signal, from the indications of process and temperature for the at least one circuit, and from the at least one output voltage of the voltage regulator. The controller is further adapted to provide the body-bias signal to at least one transistor in the at least one circuit, and to provide the voltage-level signal to the voltage regulator.
摘要:
Integrated circuits with memory elements are provided. An integrated circuit may include logic circuitry formed in a first portion having complementary metal-oxide-semiconductor (CMOS) devices and may include at least a portion of the memory elements and associated memory circuitry formed in a second portion having nano-electromechanical (NEM) relay devices. The NEM and CMOS devices may be interconnected through vias in a dielectric stack. Devices in the first and second portions may receive respective power supply voltages. In one suitable arrangement, the memory elements may include two relay switches that provide nonvolatile storage characteristics and soft error upset (SEU) immunity. In another suitable arrangement, the memory elements may include first and second cross-coupled inverting circuits. The first inverting circuit may include relay switches, whereas the second inverting circuit includes only CMOS transistors. Memory elements configured in this way may be used to provide volatile storage characteristics and SEU immunity.
摘要:
In an exemplary embodiment, an apparatus includes a first set of circuit elements and a second set of circuit elements. The first set of circuit elements is used in a first configuration of the apparatus, and the second set of circuit elements is used in a second configuration of the apparatus. The first configuration of the apparatus is switched to the second configuration of the apparatus in order to improve reliability of the apparatus.
摘要:
A programmable logic device (PLD) includes a delay circuit and a body-bias generator. The delay circuit has a delay configured to represent a delay of user circuit implement in the PLD. The body-bias generator is configured to adjust the body bias of a transistor within the user circuit. The body-bias generator adjusts the body bias of the transistor in response to a level derived from the signal propagation delay of the delay circuit.
摘要:
Integrated circuits such as programmable logic device integrated circuits are provided that have configuration random-access memory elements. The configuration random-access memory elements are loaded with configuration data to customize programmable logic on the integrated circuits. Each memory element has a capacitor that stores data for that memory element. A pair of cross-coupled inverters are connected to the capacitor. The inverters ensure that the memory elements produce output control signals with voltages than range from one power supply rail to another. Each configuration random-access memory element may have a clear transistor. The capacitor may be formed in a dielectric layer that lies above the transistors of the inverters, the address transistor, and the clear transistor. The inverters may be powered with an elevated power supply voltage.
摘要:
Integrated circuit bond pads are provided for forming wire bonds to integrated circuit package pins. Each pad uses a bond pad structure that provides room for under-pad circuitry. The under-pad circuitry can be connected to other circuitry on the integrated circuit, thereby providing efficient use of circuit real estate. The bond pad structures are formed in the dielectric stack portion of the integrated circuit using dummy bond pads and bond pad support structures. Bond pad support structures may be formed from metal in metal interconnect layers. Vias may be used to connect the bond pad support structures to each other and to the dummy bond pads. Bond pad support structures may be formed in a polysilicon layer at the bottom of the dielectric stack. A contact layer contains metal plugs that connect the polysilicon bond pad support structures to the lowermost metal-layer bond pad support structures.
摘要:
A deep trench capacitor includes a trench having walls and a floor. The deep trench capacitor also includes a layer of gate oxide on the walls and floor. Gate polysilicon is deposited over the gate oxide.
摘要:
Integrated circuits such as programmable logic device integrated circuits are provided with adjustable configuration random-access-memory cell power supply circuitry. The adjustable configuration random-access-memory cell power supply circuitry powers configuration random-access-memory cells on an integrated circuit. During operation of the integrated circuit, the configuration random-access-memory cells provide static output signals that turn on and off associated pass transistors. The adjustable power supply circuitry can be configured to produce different power supply voltages on different portions of an integrated circuit. The different power supply voltages accommodate circuit design constraints while minimizing power consumption due to pass transistor leakage.