The invention provides an automatic system and method using x-ray inspection to image arrays of electrical interconnections on electronic devices. The electron beam of a rotating anode X-ray tube is deflected relative to the anode to cause emission of x-rays from different regions of the anode at different times. The x-ray tube is located at an inspection station for the electronic devices and disposed to irradiate a first part of the array of interconnections with x-rays emitted from a first region of the anode and to irradiate a further part of the array of interconnections with x-rays emitted from another region of the anode. X-rays emerging from the array of interconnections are detected and used to image part at least of the array in order to automatically register interconnection integrity failures and/or detect a performance trend in the formation of the connections. Typically, the arrays of electrical interconnections are established between a ball grid array on the underside of an electronics package and an array of blobs of solder paste on a printed circuit board.