Invention Grant
- Patent Title: Etching composition
- Patent Title (中): 蚀刻组成
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Application No.: US13827861Application Date: 2013-03-14
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Publication No.: US08709277B2Publication Date: 2014-04-29
- Inventor: Kazutaka Takahashi , Atsushi Mizutani , Tomonori Takahashi
- Applicant: Fujifilm Electronic Materials U.S.A., Inc. , Fujifilm Corporation
- Applicant Address: JP Tokyo US RI North Kingstown
- Assignee: FUJIFILM Corporation,Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee: FUJIFILM Corporation,Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee Address: JP Tokyo US RI North Kingstown
- Agency: Fish & Richardson P.C.
- Main IPC: C09K13/00
- IPC: C09K13/00
Abstract:
This disclosure relates to an etching composition containing about 60% to about 95% of at least one sulfonic acid; about 0.005% to about 0.04% of chloride anion; about 0.03% to about 0.27% of bromide anion; about 0.1% to about 20% of nitrate or nitrosyl ion; and about 3% to about 37% of water.
Public/Granted literature
- US20140073140A1 Etching Composition Public/Granted day:2014-03-13
Information query
