发明授权
- 专利标题： Power device and method of packaging same
- 专利标题（中）： 动力装置及其包装方法
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申请号： US13549518申请日： 2012-07-16
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公开(公告)号： US08709875B2公开(公告)日： 2014-04-29
- 发明人: Jinzhong Yao , Zhigang Bai , Xuesong Xu
- 申请人： Jinzhong Yao , Zhigang Bai , Xuesong Xu
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 优先权： CN201110253157 20110831
- 主分类号： H01L21/48
- IPC分类号： H01L21/48
摘要：
A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.
公开/授权文献
- US20130049183A1 POWER DEVICE AND METHOD OF PACKAGING SAME 公开/授权日：2013-02-28
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