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    Lead frame for semiconductor device
    2.
    发明授权
    Lead frame for semiconductor device 有权
    半导体器件引线框架

    公开(公告)号：US08525311B2

    公开(公告)日：2013-09-03

    申请号：US13170206

    申请日：2011-06-28

    申请人： Zhigang Bai ,  Jinzhong Yao ,  Xuesong Xu

    发明人： Zhigang Bai ,  Jinzhong Yao ,  Xuesong Xu

    IPC分类号： H01L33/62

    CPC分类号： H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers.

    摘要翻译： 用于半导体器件的引线框具有具有用于接收半导体管芯的第一主表面的管芯焊盘和环绕管芯焊盘的连接杆。 从连接杆朝向管芯焊盘突出的第一引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第一引线指的近端位于第一平面中。 从连接杆朝向管芯焊盘突出的第二引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第二引线指的近端位于与第一平面平行并间隔开的第二平面中。 隔离框架设置在第一和第二引线指的近端之间。 隔离框架分离但支撑第一和第二引线指的近端。

    LEADFRAME FOR SEMICONDUCTOR DEVICE
    3.
    发明申请
    LEADFRAME FOR SEMICONDUCTOR DEVICE 有权
    半导体器件的LEADFRAME

    公开(公告)号：US20120056311A1

    公开(公告)日：2012-03-08

    申请号：US13170206

    申请日：2011-06-28

    申请人： Zhigang BAI ,  Jinzhong Yao ,  Xuesong Xu

    发明人： Zhigang BAI ,  Jinzhong Yao ,  Xuesong Xu

    IPC分类号： H01L23/495 ,  H01L21/56

    CPC分类号： H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers.

    摘要翻译： 用于半导体器件的引线框具有具有用于接收半导体管芯的第一主表面的管芯焊盘和环绕管芯焊盘的连接杆。 从连接杆朝向管芯焊盘突出的第一引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第一引线指的近端位于第一平面中。 从连接杆朝向管芯焊盘突出的第二引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第二引线指的近端位于与第一平面平行并间隔开的第二平面中。 隔离框架设置在第一和第二引线指的近端之间。 隔离框架分离但支撑第一和第二引线指的近端。

    PRESSURE SENSOR AND METHOD OF PACKAGING SAME
    4.
    发明申请
    PRESSURE SENSOR AND METHOD OF PACKAGING SAME 有权
    压力传感器及其包装方法

    公开(公告)号：US20140206124A1

    公开(公告)日：2014-07-24

    申请号：US14219011

    申请日：2014-03-19

    申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    IPC分类号： H01L41/25

    CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

    摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

    PRESSURE SENSOR AND METHOD OF PACKAGING SAME
    6.
    发明申请
    PRESSURE SENSOR AND METHOD OF PACKAGING SAME 有权
    压力传感器及其包装方法

    公开(公告)号：US20120168884A1

    公开(公告)日：2012-07-05

    申请号：US13293119

    申请日：2011-11-10

    申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    IPC分类号： H01L29/84 ,  H01L21/50

    CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

    摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

    Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit
    9.
    发明授权
    Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit 有权
    半导体集成电路封装及半导体集成电路封装方法

    公开(公告)号：US07727817B2

    公开(公告)日：2010-06-01

    申请号：US12403400

    申请日：2009-03-13

    申请人： Xuesong Xu ,  Nan Xu ,  Jinzhong Yao

    发明人： Xuesong Xu ,  Nan Xu ,  Jinzhong Yao

    IPC分类号： H01L21/44 ,  H01L21/48

    CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed. After curing the mold compound, removing the mold and de-taping, the mold compound filled in the clearances is recessed inward from the back surface, which increases the solderability in the subsequent surface mount process and decreases the possibility of the occurrence of lead short-circuits.

    摘要翻译： 在封装半导体IC的方法中，将带附接到引线框架阵列的后表面，并且引线框架阵列保持在模具的上模追逐和下模追逐之间，其中 引线框阵列向上。 上下模具分别相对于引线框架阵列形成上腔体和下腔体。 模具化合物分别注入上腔和下穴。 关于引线之间，芯片之间和/或引线和芯片焊盘之间的间隙，注入上腔的模具复合体在注入到下腔内的模具化合物填充间隙之前在间隙上覆盖磁带的部分 ，使得磁带被压下。 在固化模具化合物之后，除去模具和脱胶，填充间隙的模具化合物从后表面向内凹入，这增加了随后的表面贴装工艺中的可焊性，并且降低了引线短路的可能性， 电路。

    LEAD FRAME WITH SOLDER FLOW CONTROL
    10.
    发明申请
    LEAD FRAME WITH SOLDER FLOW CONTROL 有权
    铅框架与焊接流量控制

    公开(公告)号：US20080266828A1

    公开(公告)日：2008-10-30

    申请号：US12053622

    申请日：2008-03-24

    申请人： Xuesong XU ,  Meijiang Song ,  Jinzhong Yao

    发明人： Xuesong XU ,  Meijiang Song ,  Jinzhong Yao

    IPC分类号： H05K7/20 ,  H01R43/00

    CPC分类号： H01R4/028 ,  H01L23/49503 ,  H01L23/49582 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

    摘要： A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding.

    摘要翻译： 引线框架具有在其表面上具有不同润湿特性的多个区域。 例如，形成一个区域来处理镀银，而另一个区域具有较少的润湿能力。 区域之间的边界引起润湿力差，在焊料芯片接合期间阻止区域之间的熔融焊料流动。