发明授权
US08716716B2 Method and system for junction termination in GaN materials using conductivity modulation
有权
使用电导率调制的GaN材料中的结端接方法和系统
- 专利标题: Method and system for junction termination in GaN materials using conductivity modulation
- 专利标题(中): 使用电导率调制的GaN材料中的结端接方法和系统
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申请号: US13334742申请日: 2011-12-22
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公开(公告)号: US08716716B2公开(公告)日: 2014-05-06
- 发明人: Hui Nie , Andrew P. Edwards , Donald R. Disney , Richard J. Brown , Isik C. Kizilyalli
- 申请人: Hui Nie , Andrew P. Edwards , Donald R. Disney , Richard J. Brown , Isik C. Kizilyalli
- 申请人地址: US CA San Jose
- 专利权人: Avogy, Inc.
- 当前专利权人: Avogy, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 主分类号: H01L21/335
- IPC分类号: H01L21/335 ; H01L29/20
摘要:
A semiconductor structure includes a GaN substrate having a first surface and a second surface opposing the first surface. The GaN substrate is characterized by a first conductivity type and a first dopant concentration. The semiconductor structure also includes a first GaN epitaxial layer of the first conductivity type coupled to the second surface of the GaN substrate and a second GaN epitaxial layer of a second conductivity type coupled to the first GaN epitaxial layer. The second GaN epitaxial layer includes an active device region, a first junction termination region characterized by an implantation region having a first implantation profile, and a second junction termination region characterized by an implantation region having a second implantation profile.
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