Invention Grant
- Patent Title: Packaging system for a floor panel
- Patent Title (中): 地板面包装系统
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Application No.: US12859566Application Date: 2010-08-19
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Publication No.: US08720684B2Publication Date: 2014-05-13
- Inventor: Richard H. Balmer , Shih Chung Lee , Dung V. Dao , Christopher R. Knafelc , Heath E. Harrington , Kean M. Anspach , Michael E. Buckwalter , John R. Eshbach, Jr.
- Applicant: Richard H. Balmer , Shih Chung Lee , Dung V. Dao , Christopher R. Knafelc , Heath E. Harrington , Kean M. Anspach , Michael E. Buckwalter , John R. Eshbach, Jr.
- Applicant Address: US DE Wilmington
- Assignee: AWI Licensing Company
- Current Assignee: AWI Licensing Company
- Current Assignee Address: US DE Wilmington
- Agent Amy M. Fernandez
- Main IPC: B65D85/46
- IPC: B65D85/46 ; B65D85/48 ; E04B2/00

Abstract:
A packaging system and a method of packaging a plurality of floor panels in a box includes floor panels having a top layer and a bottom layer. The top layer has a top surface with a visible decorative pattern and a bottom surface adhered to a top surface of the bottom layer such that the bottom layer is offset from the top layer in a direction of length and width and a marginal end portion of the top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed. At least one of the marginal end portions has an adhesive. The floor panels are stacked in the box in pairs. Each of the pairs is stacked such that the top surfaces of the top layers of each of the pairs of the floor panels are facing each other.
Public/Granted literature
- US20110042252A1 Packaging system for a floor panel Public/Granted day:2011-02-24
Information query
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