发明授权
- 专利标题： Method of assembling semiconductor device including insulating substrate and heat sink
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申请号： US14155309申请日： 2014-01-14
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公开(公告)号： US08722465B1公开(公告)日： 2014-05-13
- 发明人: Junhua Luo , Jinzhong Yao , Baoguan Yin
- 申请人： Junhua Luo , Jinzhong Yao , Baoguan Yin
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 优先权： CN201110094128 20110415
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.