Invention Grant
- Patent Title: Semiconductor packaging and fabrication method using connecting plate for internal connection
- Patent Title (中): 使用连接板进行内部连接的半导体封装和制造方法
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Application No.: US12722528Application Date: 2010-03-12
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Publication No.: US08722466B2Publication Date: 2014-05-13
- Inventor: Jun Lu , Kai Liu , Yan Xun Xue
- Applicant: Jun Lu , Kai Liu , Yan Xun Xue
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: C H Emily LLC
- Agent Chein-Hwa Tsao
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding.
Public/Granted literature
- US20110221008A1 Semiconductor Packaging and Fabrication Method Using Connecting Plate for Internal Connection Public/Granted day:2011-09-15
Information query
IPC分类:
