Invention Grant
US08722481B2 Superior integrity of high-k metal gate stacks by preserving a resist material above end caps of gate electrode structures
有权
通过在栅极电极结构的端盖上方保留抗蚀材料,可以实现高k金属栅极叠层的完整性
- Patent Title: Superior integrity of high-k metal gate stacks by preserving a resist material above end caps of gate electrode structures
- Patent Title (中): 通过在栅极电极结构的端盖上方保留抗蚀材料,可以实现高k金属栅极叠层的完整性
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Application No.: US13909221Application Date: 2013-06-04
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Publication No.: US08722481B2Publication Date: 2014-05-13
- Inventor: Stephan-Detlef Kronholz , Peter Javorka , Maciej Wiatr
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Gand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Gand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234

Abstract:
When forming high-k metal gate electrode structures in a semiconductor device on the basis of a basic transistor design, undue exposure of sensitive materials at end portions of the gate electrode structures of N-channel transistors may be avoided, for instance, prior to and upon incorporating a strain-inducing semiconductor material into the active region of P-channel transistors, thereby contributing to superior production yield for predefined transistor characteristics and performance.
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