发明授权
US08722486B2 Enhancing deposition uniformity of a channel semiconductor alloy by forming a recess prior to the well implantation
有权
通过在阱注入之前形成凹槽来提高通道半导体合金的沉积均匀性
- 专利标题: Enhancing deposition uniformity of a channel semiconductor alloy by forming a recess prior to the well implantation
- 专利标题(中): 通过在阱注入之前形成凹槽来提高通道半导体合金的沉积均匀性
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申请号: US12908053申请日: 2010-10-20
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公开(公告)号: US08722486B2公开(公告)日: 2014-05-13
- 发明人: Stephan Kronholz , Maciej Wiatr , Roman Boschke , Peter Javorka
- 申请人: Stephan Kronholz , Maciej Wiatr , Roman Boschke , Peter Javorka
- 申请人地址: KY Grand Cayman
- 专利权人: GLOBALFOUNDRIES Inc.
- 当前专利权人: GLOBALFOUNDRIES Inc.
- 当前专利权人地址: KY Grand Cayman
- 代理机构: Amerson Law Firm, PLLC
- 优先权: DE102009055394 20091230
- 主分类号: H01L21/8238
- IPC分类号: H01L21/8238
摘要:
When forming sophisticated gate electrode structures requiring a threshold adjusting semiconductor alloy for one type of transistor, a recess is formed in the corresponding active region, thereby providing superior process uniformity during the deposition of the semiconductor material. Moreover, the well dopant species is implanted after the recessing, thereby avoiding undue dopant loss. Due to the recess, any exposed sidewall surface areas of the active region may be avoided during the selective epitaxial growth process, thereby significantly contributing to enhanced threshold stability of the resulting transistor including the high-k metal gate stack.
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