发明授权
- 专利标题： Integrated circuit packaging system with through silicon via and method of manufacture thereof
- 专利标题（中）： 具有硅通孔的集成电路封装系统及其制造方法
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申请号： US13517897申请日： 2012-06-14
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公开(公告)号： US08723309B2公开(公告)日： 2014-05-13
- 发明人: HanGil Shin , YeongIm Park , HeeJo Chi
- 申请人： HanGil Shin , YeongIm Park , HeeJo Chi
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L23/04
- IPC分类号： H01L23/04
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a bottom integrated circuit having bottom through silicon vias with a bottom via pitch; mounting outer interconnects over the bottom integrated circuit; and mounting a top integrated circuit between the outer interconnects, the top integrated circuit having top through silicon vias with a top via pitch less than the bottom via pitch.
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