发明授权
- 专利标题： Heat dissipation structure
- 专利标题（中）： 散热结构
-
申请号： US13456498申请日： 2012-04-26
-
公开(公告)号： US08724326B2公开(公告)日： 2014-05-13
- 发明人: Chih-Hao Yang , Bao-Quan Shi , Rong Yang , Xiang-Kun Zeng
- 申请人： Chih-Hao Yang , Bao-Quan Shi , Rong Yang , Xiang-Kun Zeng
- 申请人地址： CN Shenzhen TW New Taipei
- 专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW New Taipei
- 代理机构： Novak Druce Connolly Bove + Quigg LLP
- 优先权： CN201110423220 20111216
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.
公开/授权文献
- US20130155624A1 HEAT DISSIPATION STRUCTURE 公开/授权日：2013-06-20
信息查询
