公开(公告)号：US08724326B2

公开(公告)日：2014-05-13

申请号：US13456498

申请日：2012-04-26

申请人： Chih-Hao Yang ,  Bao-Quan Shi ,  Rong Yang ,  Xiang-Kun Zeng

发明人： Chih-Hao Yang ,  Bao-Quan Shi ,  Rong Yang ,  Xiang-Kun Zeng

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.

摘要翻译： 散热结构包括散热器，散热器具有形成有从基座的四个角横向延伸的四个固定突出部的基座。 四个定位柱从印刷电路板向上突出。 四个弹簧夹分别连接在四个定位柱上。 四个弹簧夹中的每一个具有弹性件，用于施加向下的力以按压相应的固定突片，从而将散热器固定到印刷电路板。

公开(公告)号：US08773857B2

公开(公告)日：2014-07-08

申请号：US13526604

申请日：2012-06-19

申请人： Chih-Hao Yang ,  Xiang-Kun Zeng ,  Bao-Quan Shi ,  Jing-Jun Ni

发明人： Chih-Hao Yang ,  Xiang-Kun Zeng ,  Bao-Quan Shi ,  Jing-Jun Ni

IPC分类号： H05K7/20 ,  H01L23/467 ,  H01L23/40 ,  G06F1/20 ,  F16B39/10

CPC分类号： H01L23/467 ,  F16B39/10 ,  G06F1/20 ,  H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole.

摘要翻译： 散热器安装装置包括触摸板和安装构件。 触摸板限定了一个锁定孔。 安装构件包括锁定柱。 锁定柱包括主体和从主体突出的两个突起。 锁定孔的内表面限定了两个切口。 触摸板包括从触摸板的底表面上的锁定孔的边缘延伸的两个阻挡块。 两个突起从两个切口延伸并邻接触摸板的底表面。 两个突起中的一个位于两个阻挡块之间，以防止主体在锁定孔中自由旋转。

公开(公告)号：US08659891B2

公开(公告)日：2014-02-25

申请号：US13095868

申请日：2011-04-28

申请人： Hua Huang ,  Xiang-Kun Zeng ,  Zhi-Jiang Yao ,  Li-Fu Xu

发明人： Hua Huang ,  Xiang-Kun Zeng ,  Zhi-Jiang Yao ,  Li-Fu Xu

IPC分类号： H05K7/20

CPC分类号： G06F1/20

摘要： A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

摘要翻译： 散热系统包括具有基板和背板，散热器，第二热源和空气隔板的计算机外壳。 后板限定与散热器对准的多个第一空气出口孔和与第二热源对准的多个第二空气出口孔。 散热器位于与第一热源接触的基板上。 第二热源位于与基板相邻的基板上。 空气分隔板位于主板和第二热源之间的基板上。 在空气隔板和多个第一空气出口孔之间限定第一空气通道。 在空气隔板和多个第二空气出口孔之间限定第二空气路径。

公开(公告)号：US08081444B2

公开(公告)日：2011-12-20

申请号：US12697219

申请日：2010-01-30

申请人： Bo Xiao ,  Xiang-Kun Zeng ,  Zhi-Guo Zhang ,  Li-Fu Xu

发明人： Bo Xiao ,  Xiang-Kun Zeng ,  Zhi-Guo Zhang ,  Li-Fu Xu

IPC分类号： H05K5/00 ,  H05K7/20 ,  G06F1/20 ,  A47B81/00

CPC分类号： G06F1/20

摘要： A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.

摘要翻译： 计算机系统包括底盘和气流引导导管。 底盘包括机箱底壁，底盘前壁和底盘后壁。 底盘前壁限定第一通风孔，底盘后壁限定第二通风孔。 主机板固定在机箱前壁和底盘后墙之间的机箱底壁上。 存储卡固定在主板上。 气流引导管固定在底盘中，并包括入口部分。 入口部分覆盖存储卡的一部分，以引导气流。 气流通过第一个通气孔，存储卡上方流过底盘，然后通过第二个通风孔流出机箱。

公开(公告)号：US08737070B2

公开(公告)日：2014-05-27

申请号：US13195004

申请日：2011-08-01

申请人： Chao-Jun Zhu ,  Xiang-Kun Zeng ,  Zhi-Jiang Yao ,  Li-Fu Xu

发明人： Chao-Jun Zhu ,  Xiang-Kun Zeng ,  Zhi-Jiang Yao ,  Li-Fu Xu

IPC分类号： H05K7/20

CPC分类号： G06F1/20

摘要： A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.

摘要翻译： 散热系统包括外壳，第一散热器，第二散热器和风扇。 外壳包括底板，第一侧板和第二侧板。 第一排气区位于第一侧板上。 第二通气区域位于第二侧板上。 第一发热装置和第二发热装置安装在底板上并且位于第一通气区域和第二通气区域之间。 第一散热器安装在底板上并接触第一发热装置。 第二散热器安装在底板上并接触第二发热装置。 多个第二散热片位于第二散热器上。 每个第二个鳍都是波浪的。 风扇位于第一通气区域和第二通气区域之间。 风扇适于驱动空气流过第一通气区域，第一散热器，多个第二散热片和第二通气区域。