发明授权
- 专利标题： Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits
- 专利标题（中）： 电子和光电集成电路之间增强的低电感互连
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申请号： US13421833申请日： 2012-03-15
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公开(公告)号： US08724939B2公开(公告)日： 2014-05-13
- 发明人: Kalpendu Shastri , Bipin Dama , Mark Webster , David Piede
- 申请人： Kalpendu Shastri , Bipin Dama , Mark Webster , David Piede
- 申请人地址： US CA San Jose
- 专利权人： Cisco Technology, Inc.
- 当前专利权人： Cisco Technology, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Patterson & Sheridan LLP
- 主分类号： G02B6/12
- IPC分类号： G02B6/12 ; G02F1/01 ; G02F1/035
摘要：
A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.