发明授权
- 专利标题: Semiconductor fabrication device welded bellows
- 专利标题(中): 半导体制造装置焊接波纹管
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申请号: US14110641申请日: 2012-03-09
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公开(公告)号: US08727355B2公开(公告)日: 2014-05-20
- 发明人: Hidekazu Takahashi , Masahiko Inoue , Hiroyuki Ochiai
- 申请人: Hidekazu Takahashi , Masahiko Inoue , Hiroyuki Ochiai
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Eagle Industry Co., Ltd.,EagleBurgmann Japan Co., Ltd.
- 当前专利权人: Eagle Industry Co., Ltd.,EagleBurgmann Japan Co., Ltd.
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: Law Office of Katsuhiro Arai
- 优先权: JP2011-097745 20110426
- 国际申请: PCT/JP2012/056061 WO 20120309
- 国际公布: WO2012/147416 WO 20121101
- 主分类号: F16J15/52
- IPC分类号: F16J15/52 ; F16J3/04
摘要:
A semiconductor fabrication device welded bellows of an accordion structure is characterized in that a plurality of annular bellows plates having faces curving in a radial direction are connected alternatingly at the outside diameter side and inside diameter side, wherein the annular bellows plates are provided with a treatment-side bellows plate and a non-treatment-side bellows plate, a gas layer disposed between the two bellows plates, the treatment-side bellows plate being of lesser thickness, and the non-treatment-side bellows plate being of greater thickness. The bellows are highly resistant to damage caused by foreign matter; or, in the unlikely case that the treatment-side bellows plate becomes damaged, the damage can be compensated for by the non-treatment side bellows plate.
公开/授权文献
- US20140035236A1 SEMICONDUCTOR FABRICATION DEVICE WELDED BELLOWS 公开/授权日:2014-02-06
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