WELDED BELLOWS FOR SEMICONDUCTOR MANUFACTURING DEVICE
    1.
    发明申请
    WELDED BELLOWS FOR SEMICONDUCTOR MANUFACTURING DEVICE 有权
    用于半导体制造设备的焊接式电池

    公开(公告)号:US20140082906A1

    公开(公告)日:2014-03-27

    申请号:US14110651

    申请日:2012-03-09

    IPC分类号: H01L21/00

    CPC分类号: H01L21/00 F16J3/047 Y10T29/41

    摘要: An accordion-structured welded bellows for a semiconductor-manufacturing device is characterized in that a plurality of annular bellows plates having curved surfaces in a radial direction are connected in an alternating fashion on the outside-diameter side and the inside-diameter side, wherein the annular bellows plates have a processing-side bellows plate and a non-processing-side bellows plate, a gas layer is interposed between the two bellows plates, the processing-side bellows plate is configured as a thick plate, and the non-processing-side bellows plate is configured as a thin plate. The welded bellows is less likely to be damaged by foreign matter and to be able to use the non-processing-side bellows plate to compensate for any damage to the processing-side bellows plate.

    摘要翻译: 用于半导体制造装置的手风琴结构化的波纹管的特征在于,具有径向弯曲表面的多个环形波纹管板以交替的方式连接在外径侧和内径侧上,其中, 环形波纹管板具有处理侧波纹管板和非加工侧波纹管板,气体层插入在两个波纹管板之间,处理侧波纹管板构造为厚板, 侧面波纹管板被配置为薄板。 焊接的波纹管不太可能被异物损坏,并且能够使用非加工侧波纹管板来补偿对加工侧波纹管板的任何损坏。

    Welded bellows for semiconductor manufacturing device
    2.
    发明授权
    Welded bellows for semiconductor manufacturing device 有权
    焊接波纹管用于半导体制造装置

    公开(公告)号:US09147571B2

    公开(公告)日:2015-09-29

    申请号:US14110651

    申请日:2012-03-09

    IPC分类号: F16J15/00 H01L21/00 F16J3/04

    CPC分类号: H01L21/00 F16J3/047 Y10T29/41

    摘要: An accordion-structured welded bellows for a semiconductor-manufacturing device is characterized in that a plurality of annular bellows plates having curved surfaces in a radial direction are connected in an alternating fashion on the outside-diameter side and the inside-diameter side, wherein the annular bellows plates have a processing-side bellows plate and a non-processing-side bellows plate, a gas layer is interposed between the two bellows plates, the processing-side bellows plate is configured as a thick plate, and the non-processing-side bellows plate is configured as a thin plate. The welded bellows is less likely to be damaged by foreign matter and to be able to use the non-processing-side bellows plate to compensate for any damage to the processing-side bellows plate.

    摘要翻译: 用于半导体制造装置的手风琴结构化的波纹管的特征在于,具有径向弯曲表面的多个环形波纹管板以交替的方式连接在外径侧和内径侧上,其中, 环形波纹管板具有处理侧波纹管板和非加工侧波纹管板,气体层插入在两个波纹管板之间,处理侧波纹管板构造为厚板, 侧面波纹管板被配置为薄板。 焊接的波纹管不太可能被异物损坏,并且能够使用非加工侧波纹管板来补偿对加工侧波纹管板的任何损坏。

    Semiconductor fabrication device welded bellows
    3.
    发明授权
    Semiconductor fabrication device welded bellows 有权
    半导体制造装置焊接波纹管

    公开(公告)号:US08727355B2

    公开(公告)日:2014-05-20

    申请号:US14110641

    申请日:2012-03-09

    IPC分类号: F16J15/52 F16J3/04

    CPC分类号: F16J15/52 F16J3/04 F16J3/047

    摘要: A semiconductor fabrication device welded bellows of an accordion structure is characterized in that a plurality of annular bellows plates having faces curving in a radial direction are connected alternatingly at the outside diameter side and inside diameter side, wherein the annular bellows plates are provided with a treatment-side bellows plate and a non-treatment-side bellows plate, a gas layer disposed between the two bellows plates, the treatment-side bellows plate being of lesser thickness, and the non-treatment-side bellows plate being of greater thickness. The bellows are highly resistant to damage caused by foreign matter; or, in the unlikely case that the treatment-side bellows plate becomes damaged, the damage can be compensated for by the non-treatment side bellows plate.

    摘要翻译: 一种手风琴式结构的半导体制造装置的波纹管,其特征在于,具有径向弯曲面的多个环状波纹管板在外径侧和内径侧交替地连接,其中,所述环形波纹管板设置有处理 侧面波纹管板和非处理侧波纹管板,设置在两个波纹管板之间的气体层,处理侧波纹管板的厚度较小,非处理侧波纹管板的厚度更大。 波纹管高度抵抗异物造成的损坏; 或者在不可能的情况下,处理侧波纹管板损坏,则可以通过非处理侧波纹管板补偿损坏。

    SEMICONDUCTOR FABRICATION DEVICE WELDED BELLOWS
    4.
    发明申请
    SEMICONDUCTOR FABRICATION DEVICE WELDED BELLOWS 有权
    半导体制造设备焊接的BELLOWS

    公开(公告)号:US20140035236A1

    公开(公告)日:2014-02-06

    申请号:US14110641

    申请日:2012-03-09

    IPC分类号: F16J15/52 F16J3/04

    CPC分类号: F16J15/52 F16J3/04 F16J3/047

    摘要: A semiconductor fabrication device welded bellows of an accordion structure is characterized in that a plurality of annular bellows plates having faces curving in a radial direction are connected alternatingly at the outside diameter side and inside diameter side, wherein the annular bellows plates are provided with a treatment-side bellows plate and a non-treatment-side bellows plate, a gas layer disposed between the two bellows plates, the treatment-side bellows plate being of lesser thickness, and the non-treatment-side bellows plate being of greater thickness. The bellows are highly resistant to damage caused by foreign matter; or, in the unlikely case that the treatment-side bellows plate becomes damaged, the damage can be compensated for by the non-treatment side bellows plate.

    摘要翻译: 一种手风琴式结构的半导体制造装置的波纹管,其特征在于,具有径向弯曲面的多个环状波纹管板在外径侧和内径侧交替地连接,其中,所述环形波纹管板设置有处理 侧面波纹管板和非处理侧波纹管板,设置在两个波纹管板之间的气体层,处理侧波纹管板的厚度较小,非处理侧波纹管板的厚度更大。 波纹管高度抵抗异物造成的损坏; 或者在不可能的情况下,处理侧波纹管板损坏,则可以通过非处理侧波纹管板补偿损坏。

    Method and device for measuring wafer potential or temperature
    5.
    发明授权
    Method and device for measuring wafer potential or temperature 有权
    用于测量晶片电位或温度的方法和装置

    公开(公告)号:US07335315B2

    公开(公告)日:2008-02-26

    申请号:US10513396

    申请日:2003-06-17

    IPC分类号: G01L21/30

    摘要: The present invention attracts a wafer 6, placed on a susceptor 5, toward the susceptor 5 by the electrostatic attractive power of an electrostatic chuck electrode 7, varies the output voltage of a variable direct current power source 23 for the electrostatic chuck electrode 7 while measuring the temperature of the wafer 6 by a temperature detection sensor 21; and detects the potential of the wafer 6 based on the output voltage of the variable direct current power source 23 at a time when the temperature of the wafer 6 peaks.

    摘要翻译: 本发明通过静电卡盘电极7的静电吸引力吸引放置在基座5上的晶片6,从而使静电卡盘电极7的可变直流电源23的输出电压变化,同时测量 温度检测传感器21的晶片6的温度; 并且在晶片6的温度高峰时基于可变直流电源23的输出电压来检测晶片6的电位。

    Vibration exciting apparatus and vibration testing apparatus for structure using same
    6.
    发明授权
    Vibration exciting apparatus and vibration testing apparatus for structure using same 有权
    振动激振装置及其结构振动试验装置

    公开(公告)号:US06721668B1

    公开(公告)日:2004-04-13

    申请号:US09381037

    申请日:1999-12-02

    IPC分类号: G01F1700

    CPC分类号: G01M7/06 G01M7/022

    摘要: The testing performs a vibration excitation testing of a part of the structure, performs a numerical calculus of vibration response of the other parts of the structure, and calculates the vibration response of a whole of the structure by combining these two methods. Testing includes calculating a position of a point of exciting force on the basis of vibration exciting, and calculating a reaction force on the basis of a load detected and the position of the point of exciting force. Then, a displacement of a numerical model is computed by using the reaction force calculated and a known external force, and calculating a vibration exciting machine displacement command value on the basis of the displacement. A drive drives the vibration exciting on the basis of an output thereof. Vibration excitation is performed in the translational direction as well as the rotational direction.

    摘要翻译: 该测试对结构的一部分进行振动激励测试,对结构的其他部分进行振动响应的数值计算,并通过组合这两种方法来计算整个结构的振动响应。 测试包括基于振动激励来计算激励力点的位置,并且基于检测到的负载和激励力点的位置来计算反作用力。 然后,通过使用计算的反作用力和已知的外力来计算数值模型的位移,并且基于位移计算振动激振机械位移指令值。 驱动器基于其输出驱动振动激励。 在平移方向以及旋转方向进行振动激励。

    Inspection of solder bump lighted with rays of light intersecting at predetermined angle
    7.
    发明授权
    Inspection of solder bump lighted with rays of light intersecting at predetermined angle 失效
    检查以与预定角度相交的光线点亮的焊料凸点

    公开(公告)号:US06608921B1

    公开(公告)日:2003-08-19

    申请号:US09378035

    申请日:1999-08-20

    IPC分类号: G06K900

    摘要: A bump inspecting apparatus lights a spherical solder bump mounted on the surface of a circuit board and has a reinforcing resin applied to the lower half thereof from all circumferential directions with rays of light which intersect at a predetermined angle. An image of the lighted solder bump is captured while the amount of light irradiated upon the central portion of a solder bump is reduced. An object is extracted from image data obtained by the image capture and the area and/or the aspect ratio of the object are confirmed. The quality of the state of the reinforcing resin applied to the solder bump can be inspected.

    摘要翻译: 凸块检查装置点亮安装在电路板表面上的球形焊料凸块,并且具有从所有圆周方向向其下半部分施加与预定角度相交的光线的增强树脂。 捕获点燃的焊料凸块的图像,同时照射到焊料凸块的中心部分的光量减少。 从通过图像捕获获得的图像数据中提取对象,并确认对象的面积和/或纵横比。 可以检查施加到焊料凸块的增强树脂的状态的质量。

    Complex-type article conveying apparatus
    8.
    发明授权
    Complex-type article conveying apparatus 失效
    复合型物品输送装置

    公开(公告)号:US5993144A

    公开(公告)日:1999-11-30

    申请号:US999226

    申请日:1997-12-29

    申请人: Masahiko Inoue

    发明人: Masahiko Inoue

    CPC分类号: B65G47/918 B21D43/18 B23Q7/04

    摘要: In a conveying apparatus for conveying works between a first lower die and a second lower die in a press machine, a distal end portion of a multi-joint robot is connected to a linear shaft body, and the linear shaft body carries a linearly reciprocating body movable in the directions of the length of the linear shaft body. The linearly reciprocating body is connected to a first detachable holding device that holds a first work. The linear shaft body is connected to a second detachable holding device that holds a second work. The first work is transferred by motion of the linear shaft body and the motion of the linearly reciprocating body carrying the first holding device, and the second work is transferred by motion of the linear shaft body alone. The holding of the first work and the holding of second work are started approximately at the same timing, but the releasing of the first work and the releasing of the second work are performed at different timings in accordance with the positions at which their conveyances are completed.

    摘要翻译: 在用于在冲压机中在第一下模和第二下模之间输送工件的输送装置中,多关节机器人的远端部连接到直线轴体,直线轴体承载线性往复运动体 可沿直线轴体的长度方向移动。 线性往复体连接到保持第一工件的第一可拆卸保持装置。 直线轴体连接到保持第二工件的第二可拆卸保持装置。 第一工作通过直线轴体的运动和承载第一保持装置的线性往复体的运动而传递,第二工作通过单独的直线轴体的运动传递。 第一项工作的召开和第二次工作的召开大概是在同一时间开始的,但是第一次工作的释放和第二次工作的释放是按照他们的交通工具完成的位置在不同的时间进行的 。

    Electrode composition material for polymer electrolyte fuel cell and
process of preparing same
    9.
    发明授权
    Electrode composition material for polymer electrolyte fuel cell and process of preparing same 失效
    用于聚合物电解质燃料电池的电极组合物材料及其制备方法

    公开(公告)号:US5766788A

    公开(公告)日:1998-06-16

    申请号:US604878

    申请日:1996-02-22

    摘要: Disclosed herein are electrode composition material for a polymer electrolyte fuel cell and a process of preparing same. The electrode composition material includes agglomerates composed of catalyst-loading particles coated with or not coated with ion exchange resin having two particle distribution peaks. The electrode composition material having the two particle distribution peaks supplements the drawbacks of excessively fine particles and of excessively coarse particles and can obtain the excellent cell performance.

    摘要翻译: 本文公开了用于固体高分子型燃料电池的电极组合物材料及其制备方法。 电极组合物材料包括由涂覆有或未涂覆有具有两个颗粒分布峰的离子交换树脂的催化剂负载颗粒组成的附聚物。 具有两个颗粒分布峰的电极组合物材料补充了过细的颗粒和过粗的颗粒的缺点,并且可以获得优异的电池性能。

    PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE
    10.
    发明申请
    PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE 有权
    等离子体处理方法和等离子体处理装置

    公开(公告)号:US20090176380A1

    公开(公告)日:2009-07-09

    申请号:US12373146

    申请日:2007-07-24

    IPC分类号: H01L21/31 B05C11/00

    摘要: Provided are a plasma treatment method and a plasma treatment device capable of forming a silicon nitride film having high compressive stress. In the plasma treatment method for depositing the silicon nitride film on a process target substrate by use of plasma of raw material gas containing silicon and hydrogen and of nitrogen gas, ion energy for disconnecting nitrogen-hydrogen bonding representing a state of bonding between the hydrogen in the raw material gas and the nitrogen gas is applied to the process target substrate so as to reduce an amount of nitrogen-hydrogen bonding contained in the silicon nitride film.

    摘要翻译: 提供能够形成具有高压缩应力的氮化硅膜的等离子体处理方法和等离子体处理装置。 在通过使用含有硅和氢气和氮气的原料气体的等离子体将氮化硅膜沉积在工艺目标衬底上的等离子体处理方法中,用于断开代表氢的键合状态的氮 - 氢键的离子能 将原料气体和氮气施加到处理对象基板,以减少氮化硅膜中所含的氮 - 氢键的量。