Invention Grant
- Patent Title: Method for the thermal characterization of a portion of material
- Patent Title (中): 一部分材料的热表征方法
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Application No.: US13502921Application Date: 2010-10-28
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Publication No.: US08727609B2Publication Date: 2014-05-20
- Inventor: David Hauser , Marc Plissonnier
- Applicant: David Hauser , Marc Plissonnier
- Applicant Address: FR Paris
- Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR0957697 20091030
- International Application: PCT/EP2010/066326 WO 20101028
- International Announcement: WO2011/051376 WO 20110505
- Main IPC: G01N25/18
- IPC: G01N25/18 ; G01K7/00 ; G01K13/00

Abstract:
A method for thermal characterization of a portion of first material of elongate shape on which there is arranged a portion of a second, electrically conductive material of elongate shape, the method including: a) determining characteristic of the portion of second material, b) applying an electric current of angular frequency between ends of the portion of the second material, and measuring the angular frequency harmonic of the electric voltage between these ends for different values of angular frequency, c) calculating coefficient of thermal conductivity of the portion of first material from the values of the harmonic and of the determined characteristic, a width of the portion of the first material being between about 0.9 and 1.1 times the width of the portion of second material, the portion of first material being surrounded by thermal insulation.
Public/Granted literature
- US20120207188A1 METHOD FOR THE THERMAL CHARACTERIZATION OF A PORTION OF MATERIAL Public/Granted day:2012-08-16
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