发明授权
US08728711B2 Cleaning reticle, method for cleaning reticle stage, and method for manufacturing semiconductor device
有权
清洁掩模版,清洁掩模版的方法以及制造半导体器件的方法
- 专利标题: Cleaning reticle, method for cleaning reticle stage, and method for manufacturing semiconductor device
- 专利标题(中): 清洁掩模版,清洁掩模版的方法以及制造半导体器件的方法
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申请号: US12971468申请日: 2010-12-17
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公开(公告)号: US08728711B2公开(公告)日: 2014-05-20
- 发明人: Yumi Nakajima , Suigen Kyoh , Ryoichi Inanami
- 申请人: Yumi Nakajima , Suigen Kyoh , Ryoichi Inanami
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权: JP2009-293859 20091225
- 主分类号: G03F7/20
- IPC分类号: G03F7/20
摘要:
In one embodiment, a method for cleaning a reticle stage of an extreme ultraviolet exposure apparatus is disclosed. The method can include pressing a particle catching layer of a cleaning reticle onto the reticle stage, and the cleaning reticle includes the particle catching layer formed on a substrate. The method can include peeling the cleaning reticle from the reticle stage. The method can include removing the particle catching layer from the substrate. I addition, the method can include forming a new particle catching layer on the substrate having the particle catching layer removed.
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