Transferring pattern onto semiconductor substrate using optimum transfer condition determined for each divided area
    2.
    发明授权
    Transferring pattern onto semiconductor substrate using optimum transfer condition determined for each divided area 有权
    使用为每个分割区域确定的最佳转印条件将图案转印到半导体衬底上

    公开(公告)号:US08392855B2

    公开(公告)日:2013-03-05

    申请号:US13040294

    申请日:2011-03-04

    IPC分类号: G06F17/50

    摘要: According to one embodiment, a pattern forming method comprises transferring a pattern formed in a surface of a template to a plurality of chip areas in a semiconductor substrate under different transfer conditions. Furthermore, the transferring the pattern formed in the surface of the template to the plurality of chip areas in the semiconductor substrate under the different transfer conditions comprises transferring the pattern formed in the surface of the template to the semiconductor substrate at least twice under each identical transfer condition. Moreover, the pattern forming method comprises dividing each of the plurality of chip areas into a plurality of areas, determining an optimum condition for each set of corresponding divided areas in the plurality of chip areas, and transferring the pattern onto the semiconductor substrate using the optimum transfer condition determined for each divided area.

    摘要翻译: 根据一个实施例,图案形成方法包括在不同的转移条件下将形成在模板的表面中的图案转移到半导体衬底中的多个芯片区域。 此外,在不同的转移条件下将形成在模板表面上的图案转移到半导体衬底中的多个芯片区域包括在每个相同转移下将形成在模板表面中的图案转移到半导体衬底至少两次 条件。 此外,图案形成方法包括将多个芯片区域中的每一个划分成多个区域,为多个芯片区域中的每组对应的分割区域确定最佳条件,并使用最优的方法将图案转移到半导体衬底上 为每个划分区域确定转移条件。

    IMPRINTING METHOD, IMPRINTING APPARATUS AND MEDIUM
    3.
    发明申请
    IMPRINTING METHOD, IMPRINTING APPARATUS AND MEDIUM 审中-公开
    印刷方法,印刷装置和介质

    公开(公告)号:US20120129279A1

    公开(公告)日:2012-05-24

    申请号:US13230197

    申请日:2011-09-12

    摘要: According to one embodiment, there is provided an imprinting method for applying a first hardening resin material on a substrate to be processed and transferring a pattern of a semiconductor integrated circuit formed on a template onto the substrate to be processed on which the first hardening resin material is applied, wherein a second hardening resin material with higher separability than the first hardening resin material is applied on at least part of the outer periphery of an area in which the pattern is formed by one transferring.

    摘要翻译: 根据一个实施例,提供一种压印方法,用于将第一硬化树脂材料施加到待加工的基板上,并将形成在模板上的半导体集成电路的图案转印到待加工的基板上,在该基板上第一硬化树脂材料 其中通过一次转印在其形成图案的区域的外周的至少一部分上施加具有比第一硬化树脂材料更高的分离性的第二硬化树脂材料。

    INSPECTING METHOD, TEMPLATE MANUFACTURING METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURING METHOD, AND INSPECTING SYSTEM
    5.
    发明申请
    INSPECTING METHOD, TEMPLATE MANUFACTURING METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURING METHOD, AND INSPECTING SYSTEM 审中-公开
    检测方法,模板制造方法,半导体集成电路制造方法及检测系统

    公开(公告)号:US20120045854A1

    公开(公告)日:2012-02-23

    申请号:US13208605

    申请日:2011-08-12

    IPC分类号: H01L21/66 G06F17/50

    摘要: According to one embodiment, a template for manufacturing a memory cell array comprising a relievable area and a redundant area replaceable with the relievable area is to be inspected. First, based on a defect position of a defect-detected template and position information on a relievable area, a decision is made as to whether the detected defect is positioned within the relievable area. A decision is made as to whether the number of defect-detected relievable areas exceeds the preset permissible number. When the detected defect is positioned outside the relievable area or when the number of defect-detected relievable areas exceeds the permissible number, a notification that the template has failed the inspection is output.

    摘要翻译: 根据一个实施例,将检查用于制造包括可释放区域和可释放区域可替换的冗余区域的存储单元阵列的模板。 首先,基于缺陷检测模板的缺陷位置和关于可解除区域的位置信息,判断检测到的缺陷是否位于可解除区域内。 确定缺陷检测到的可释放区域的数量是否超过预设的允许数量。 当检测到的缺陷位于可解除区域之外时,或者当缺陷检测到的可释放区域的数量超过允许数量时,输出模板检查失败的通知。

    Semiconductor device manufacturing method
    6.
    发明授权
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号:US07914958B2

    公开(公告)日:2011-03-29

    申请号:US12478408

    申请日:2009-06-04

    IPC分类号: G03C5/00 G03F9/00 B29C35/08

    摘要: A semiconductor device manufacturing method has forming a first resist pattern on the semiconductor substrate, and then, forming a first pattern on the semiconductor substrate by the use of the first resist pattern, and forming a second resist pattern on the semiconductor substrate by using an imprinter, and then, forming a second pattern on the semiconductor substrate by the use of the second resist pattern. The forming the first pattern, the first pattern smaller than a design pattern corresponding to the design data for forming a plurality of patterns on a semiconductor substrate being formed.

    摘要翻译: 半导体器件制造方法在半导体衬底上形成第一抗蚀剂图案,然后通过使用第一抗蚀剂图案在半导体衬底上形成第一图案,并通过使用打印机在半导体衬底上形成第二抗蚀剂图案 ,然后通过使用第二抗蚀剂图案在半导体衬底上形成第二图案。 形成第一图案,第一图案小于与形成在半导体衬底上形成多个图案的设计数据相对应的设计图案。

    TEMPLATE AND PATTERN FORMING METHOD
    7.
    发明申请
    TEMPLATE AND PATTERN FORMING METHOD 审中-公开
    模式和图案形成方法

    公开(公告)号:US20100308513A1

    公开(公告)日:2010-12-09

    申请号:US12796343

    申请日:2010-06-08

    IPC分类号: B29C35/08

    摘要: According to one embodiment, a template for imprint lithography includes a transparent substrate having a pattern with a recess portion and a protruding portion, and a light-shielding portion formed on a bottom surface of the recess portion and on a top surface of the protruding portion. A side wall of the protruding portion is inclined.

    摘要翻译: 根据一个实施例,用于压印光刻的模板包括具有凹陷部分和突出部分的图案的透明基板,以及形成在凹部的底表面上并且在突出部分的顶表面上的遮光部分 。 突出部的侧壁倾斜。

    REFLECTIVE MASK, MANUFACTURING METHOD FOR REFLECTIVE MASK, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
    8.
    发明申请
    REFLECTIVE MASK, MANUFACTURING METHOD FOR REFLECTIVE MASK, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE 失效
    反射掩模,反射掩模的制造方法和半导体器件的制造方法

    公开(公告)号:US20100021826A1

    公开(公告)日:2010-01-28

    申请号:US12490910

    申请日:2009-06-24

    IPC分类号: G03F1/00 G03F7/20

    CPC分类号: G03F1/24

    摘要: A reflective mask comprising: a reflective layer that is arranged on a surface on a side on which EUV light is irradiated and reflects the EUV light; a buffer layer containing Cr that is arranged on a side of the reflective layer on which the EUV light is irradiated and covers an entire surface of the reflective layer; and a non-reflective layer that is arranged on a side of the buffer layer on which the EUV light is irradiated and in which an absorber that absorbs the irradiated EUV light is arranged in a position corresponding to a mask pattern to be reduced and transferred onto a wafer.

    摘要翻译: 一种反射掩模,包括:反射层,其被布置在其上照射有EUV光的一侧的表面上并且反射所述EUV光; 包含Cr的缓冲层,其布置在其上照射有EUV光的反射层的一侧并覆盖反射层的整个表面; 以及布置在其上照射有EUV光的缓冲层侧的非反射层,并且其中吸收被照射的EUV光的吸收体被布置在与要被还原并转移到其上的掩模图案相对应的位置 晶圆。

    Electron beam writing method, electron beam writing apparatus and semiconductor device manufacturing method
    9.
    发明授权
    Electron beam writing method, electron beam writing apparatus and semiconductor device manufacturing method 失效
    电子束写入方法,电子束写入装置和半导体器件的制造方法

    公开(公告)号:US07368737B2

    公开(公告)日:2008-05-06

    申请号:US11409987

    申请日:2006-04-25

    IPC分类号: H01J37/08

    摘要: An electron beam writing method is disclosed, which includes preparing electron beam writing data structured from writing pattern data expressed by both data of VSB shots which are units of shaping beams at the time of carrying out writing a pattern and data of CP shots serving as bases of a repeating pattern, and CP aperture data into which identification numbers IDs and opening positions of respective openings of a CP aperture having openings for VSB shots and openings for CP shots are described, inputting the electron beam writing data to an electron beam writing apparatus, and expanding the electron beam writing data into data of the respective shots defined in the electron beam writing data, determining irradiation times of the respective expanded shots while correcting shot positions, and outputting control signals corresponding to shot data to repeat a shot of a desired pattern, by the electron beam writing apparatus.

    摘要翻译: 公开了一种电子束写入方法,其中包括准备电子束写入数据,该电子束写入数据由写入模式数据构成,该模式数据由作为执行写入模式时的整形波束的单元的VSB镜头的数据和用作基础的CP镜头的数据表示 描述了CP电子束写入数据到电子束写入装置的CP孔径数据,CP孔径数据ID和具有用于VSB镜头的开口的CP孔的各个开口的打开位置和CP镜头的开口位置, 并且将电子束写入数据扩展为在电子束写入数据中定义的各个镜头的数据,同时在校正镜头位置的同时确定各个扩展镜头的照射时间,并且输出对应于镜头数据的控制信号以重复所需图案的镜头 ,由电子束写入装置。

    Method of extracting characters and computer-readable recording medium
    10.
    发明授权
    Method of extracting characters and computer-readable recording medium 有权
    提取字符和计算机可读记录介质的方法

    公开(公告)号:US06543044B2

    公开(公告)日:2003-04-01

    申请号:US09814996

    申请日:2001-03-23

    IPC分类号: G21K510

    摘要: Using the hierarchy cell5, cell51, cell52, cell4 of the figure cells in the design pattern data, it is not necessary to take the actual forms of patterns and the arrangement information of data (relation between patterns, period of arrangement) into consideration, and therefore, characters for CP exposure can be extracted effectively.

    摘要翻译: 使用设计图案数据中的图形单元的层次结构单元5,单元格51,单元格52,单元格4,不需要考虑图形的实际形式和数据的排列信息(图案,排列周期之间的关系),以及 因此,可以有效地提取CP曝光的字符。