Invention Grant
- Patent Title: Reconstituted wafer warpage adjustment
- Patent Title (中): 晶圆翘曲调整
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Application No.: US12982707Application Date: 2010-12-30
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Publication No.: US08728831B2Publication Date: 2014-05-20
- Inventor: Kah Wee Gan , Yonggang Jin
- Applicant: Kah Wee Gan , Yonggang Jin
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte. Ltd.
- Current Assignee: STMicroelectronics Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A system and method for reducing warpage of a semiconductor wafer. The system includes a device for securing the semiconductor wafer in a heating area. The device includes a holding mechanism for securing an edge of the semiconductor wafer. The device further includes a pressure reducing device that reduces the pressure underneath the semiconductor device, which further secures the semiconductor device in the heating area. The heating area includes a plurality of heating and cooling zones in which the semiconductor wafer is subjected to various temperatures.
Public/Granted literature
- US20120171875A1 RECONSTITUTED WAFER WARPAGE ADJUSTMENT Public/Granted day:2012-07-05
Information query
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