发明授权
- 专利标题: Semiconductor structure and method for manufacturing the same
- 专利标题(中): 半导体结构及其制造方法
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申请号: US13379533申请日: 2011-04-25
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公开(公告)号: US08729661B2公开(公告)日: 2014-05-20
- 发明人: Zhijiong Luo , Haizhou Yin , Huilong Zhu
- 申请人: Zhijiong Luo , Haizhou Yin , Huilong Zhu
- 申请人地址: CN Beijing
- 专利权人: Institute of Microelectronics, Chince Academy of Sciences
- 当前专利权人: Institute of Microelectronics, Chince Academy of Sciences
- 当前专利权人地址: CN Beijing
- 代理机构: Oshia Liang LLP
- 优先权: CN201110006103 20110112
- 国际申请: PCT/CN2011/073266 WO 20110425
- 国际公布: WO2012/094856 WO 20120719
- 主分类号: H01L21/70
- IPC分类号: H01L21/70
摘要:
A semiconductor structure and a method for manufacturing the same are disclosed. The method comprises: disposing a first dielectric material layer on a first semiconductor layer and defining openings in the first dielectric material layer; epitaxially growing a second semiconductor layer on the first semiconductor layer via the openings defined in the first dielectric material layer, wherein the second semiconductor layer and the first semiconductor layer comprise different materials from each other; and forming plugs of a second dielectric material in the second semiconductor layer at positions where the openings are defined in the first dielectric material layer and also at middle positions between adjacent openings. According to embodiments of the disclosure, defects occurring during the heteroepitaxial growth can be effectively suppressed.