发明授权
- 专利标题： Electronic component with metal ceiling
- 专利标题（中）： 带金属天花板的电子元件
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申请号： US13556897申请日： 2012-07-24
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公开(公告)号： US08729776B2公开(公告)日： 2014-05-20
- 发明人: Takashi Matsuda , Kazunori Inoue
- 申请人： Takashi Matsuda , Kazunori Inoue
- 申请人地址： JP Tokyo
- 专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Chen Yoshimura LLP
- 优先权： JP2011-196067 20110908
- 主分类号： H01L41/08
- IPC分类号： H01L41/08 ; H03H9/10
摘要：
An electronic component includes: a substrate; a functional element located on the substrate; a wiring located on the substrate and electrically connected to the functional element; a metal ceiling located above the functional element so that a space is formed between the metal ceiling and the functional element; and a sealing portion located on the metal ceiling, wherein the metal ceiling is electrically connected to a signal wiring that is included in the wiring and transmits a high-frequency signal.
公开/授权文献
- US20130062995A1 ELECTRONIC COMPONENT 公开/授权日：2013-03-14