Invention Grant
- Patent Title: Methods of forming photoresist patterns
- Patent Title (中): 形成光刻胶图案的方法
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Application No.: US13099910Application Date: 2011-05-03
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Publication No.: US08735053B2Publication Date: 2014-05-27
- Inventor: Subramanya Mayya , Takahiro Yasue , Seok-hwan Oh , Yool Kang
- Applicant: Subramanya Mayya , Takahiro Yasue , Seok-hwan Oh , Yool Kang
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0041433 20100503
- Main IPC: G03F7/26
- IPC: G03F7/26
Abstract:
Methods of forming photoresist patterns may include forming a photoresist layer on a substrate, exposing the photoresist layer using an exposure mask, forming a preliminary pattern by developing the exposed photoresist layer and treating a surface of the preliminary pattern using a treatment agent that includes a coating polymer.
Public/Granted literature
- US20110275020A1 Methods Of Forming Photoresist Patterns Public/Granted day:2011-11-10
Information query
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