发明授权
- 专利标题: Molded microwave field director structure
- 专利标题(中): 模制微波场导演结构
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申请号: US12249070申请日: 2008-10-10
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公开(公告)号: US08735785B2公开(公告)日: 2014-05-27
- 发明人: William R. Corcoran, Jr.
- 申请人: William R. Corcoran, Jr.
- 申请人地址: US DE Wilmington
- 专利权人: E I du Pont de Nemours and Company
- 当前专利权人: E I du Pont de Nemours and Company
- 当前专利权人地址: US DE Wilmington
- 主分类号: H05B6/80
- IPC分类号: H05B6/80
摘要:
A reusable self-supporting field director structure for use in heating an article in a microwave oven is characterized by an integral array of rigid vanes extending radially outwardly from a central axis, the vanes being molded from an electrically non-conductive heat-resistant material. At least a portion of one major surface of each vane has an electrically conductive material embedded thereinto. The electrically non-conductive heat-resistant material is either a polymeric resin (with an optional reinforcing matrix) or paperboard material. A plurality of bracing members, each extending between the first major surface of one vane and the second major surface of an adjacent vane, may be integrally molded into the field director structure.
公开/授权文献
- US20090095743A1 Molded Microwave Field Director Structure 公开/授权日:2009-04-16
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