发明授权
- 专利标题： Semiconductor package
- 专利标题（中）： 半导体封装
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申请号： US13200406申请日： 2011-09-23
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公开(公告)号： US08736031B2公开(公告)日： 2014-05-27
- 发明人: Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
- 申请人： Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2011-0068930 20110712
- 主分类号： H01L23/552
- IPC分类号： H01L23/552
摘要：
There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.
公开/授权文献
- US20130015563A1 Semiconductor package 公开/授权日：2013-01-17
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