公开(公告)号：US09245858B2

公开(公告)日：2016-01-26

申请号：US13238622

申请日：2011-09-21

申请人： Myeong Woo Han ,  Do Jae Yoo ,  Jung Aun Lee ,  Jung Ho Yoon ,  Chul Gyun Park

发明人： Myeong Woo Han ,  Do Jae Yoo ,  Jung Aun Lee ,  Jung Ho Yoon ,  Chul Gyun Park

IPC分类号： H01L31/0203 ,  H01L33/52 ,  H01L31/18 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01Q1/22 ,  H01Q23/00 ,  H01Q5/40

CPC分类号： H01L23/66 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2924/01029 ,  H01L2924/15787 ,  H01L2924/181 ,  H01Q1/2283 ,  H01Q5/40 ,  H01Q23/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.

摘要翻译： 半导体器件封装设有用于无线应用的集成天线。 半导体器件封装包括其上安装有半导体芯片的衬底; 覆盖半导体芯片的保护层; 安装在保护层上的金属图案; 以及连接半导体芯片和金属图案的第一连接构件。 根据该结构，半导体器件封装能够容易地制造，同时最小化用作天线的金属图案与半导体芯片之间的电距离。

公开(公告)号：US08736031B2

公开(公告)日：2014-05-27

申请号：US13200406

申请日：2011-09-23

申请人： Jung Aun Lee ,  Myeong Woo Han ,  Do Jae Yoo ,  Chul Gyun Park

发明人： Jung Aun Lee ,  Myeong Woo Han ,  Do Jae Yoo ,  Chul Gyun Park

IPC分类号： H01L23/552

CPC分类号： H01L23/66 ,  H01L23/3121 ,  H01L2223/6677 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01L2924/00

摘要： There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.

摘要翻译： 提供了一种半导体封装，更具体地说，提供一种包括嵌入在其内部的天线的半导体封装。 半导体封装包括：半导体芯片; 主天线，其设置成与半导体芯片相邻并与其电连接; 密封半导体芯片和主天线的密封部; 以及形成在密封部分的外表面上并且连接到主天线的辅助天线。

公开(公告)号：US20130015563A1

公开(公告)日：2013-01-17

申请号：US13200406

申请日：2011-09-23

申请人： Jung Aun Lee ,  Myeong Woo Han ,  Do Jae Yoo ,  Chul Gyun Park

发明人： Jung Aun Lee ,  Myeong Woo Han ,  Do Jae Yoo ,  Chul Gyun Park

IPC分类号： H01L23/552

CPC分类号： H01L23/66 ,  H01L23/3121 ,  H01L2223/6677 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01L2924/00

摘要： There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.

摘要翻译： 提供了一种半导体封装，更具体地说，提供一种包括嵌入在其内部的天线的半导体封装。 半导体封装包括：半导体芯片; 主天线，其设置成与半导体芯片相邻并与其电连接; 密封半导体芯片和主天线的密封部; 以及形成在密封部分的外表面上并且连接到主天线的辅助天线。

公开(公告)号：US20130009320A1

公开(公告)日：2013-01-10

申请号：US13200335

申请日：2011-09-23

申请人： Do Jae Yoo ,  Jung Ho Yoon ,  Chul Gyun Park ,  Myeong Woo Han ,  Jung Aun Lee

发明人： Do Jae Yoo ,  Jung Ho Yoon ,  Chul Gyun Park ,  Myeong Woo Han ,  Jung Aun Lee

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/185 ,  H05K2203/061 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

摘要翻译： 提供了包括与其一体形成的天线的半导体封装及其制造方法。 半导体封装包括：半导体芯片; 密封半导体芯片的密封部分; 形成在所述密封部的至少一个表面上的基板部; 以及形成在所述密封部或所述基板部上并与半导体芯片电连接的天线部。

公开(公告)号：US08749434B2

公开(公告)日：2014-06-10

申请号：US12841884

申请日：2010-07-22

申请人： Myeong Woo Han ,  Jung Aun Lee ,  Chul Gyun Park ,  Seung Ho Choi ,  Moonil Kim ,  Kook Joo Lee

发明人： Myeong Woo Han ,  Jung Aun Lee ,  Chul Gyun Park ,  Seung Ho Choi ,  Moonil Kim ,  Kook Joo Lee

IPC分类号： H01Q1/38

CPC分类号： H01Q1/40 ,  H01Q9/0485 ,  H01Q13/106 ,  H01Q13/18

摘要： A dielectric resonator antenna is disclosed that includes a multi-layer substrate on which a plurality of insulating layers and conductor layers are alternately stacked. The dielectric resonator antenna also includes a first conductor plate that has an opening part on the upper portion of the top insulating layer of the multi-layer substrate and a second conductor plate that is formed on the lower portion of the bottom insulating layer from the first conductor plate. The insulating layer is formed with at least two stacked layers and is disposed at a position corresponding to the opening part. The dielectric resonator antenna also includes a plurality of first metal via holes, a feeding part and a matching substrate that is stacked on the opening part and is stacked with at least one insulating layer.

摘要翻译： 公开了一种介质谐振器天线，其包括多层基板，多层绝缘层和导体层交替层叠在该多层基板上。 介质谐振器天线还包括：第一导体板，其在多层基板的顶部绝缘层的上部具有开口部分;以及第二导体板，其形成在底部绝缘层的下部， 导体板。 绝缘层形成有至少两个层叠层，并且设置在与开口部对应的位置。 介质谐振器天线还包括多个第一金属通孔，馈电部分和匹配基板，其堆叠在开口部分上并与至少一个绝缘层堆叠。

公开(公告)号：US08692731B2

公开(公告)日：2014-04-08

申请号：US13092091

申请日：2011-04-21

申请人： Jung Aun Lee ,  Myeong Woo Han ,  Chul Gyun Park ,  Moonil Kim ,  Seung Ho Choi ,  Kook Joo Lee

发明人： Jung Aun Lee ,  Myeong Woo Han ,  Chul Gyun Park ,  Moonil Kim ,  Seung Ho Choi ,  Kook Joo Lee

IPC分类号： H01Q13/00

CPC分类号： H01Q13/10 ,  H01P3/121 ,  H01P5/024 ,  H01Q13/06

摘要： Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.

摘要翻译： 本文公开了一种电介质波导天线，包括：传送从馈电器施加的信号的电介质波导; 电介质波导辐射器，其通过第一孔辐射从所述电介质波导发射到所述空气的信号; 以及形成在电介质波导的一部分中的匹配单元，并且控制串联电抗和并联电抗，从而在电介质波导辐射器和空气之间执行阻抗匹配，以便减少在辐射期间在第一孔径中产生的反射 信号通过第一个光圈。 通过具有各种结构的匹配单元减小孔径的反射，从而可以提高电介质波导天线的特性。

公开(公告)号：US20130076570A1

公开(公告)日：2013-03-28

申请号：US13334966

申请日：2011-12-22

申请人： Jung Aun LEE ,  Myeong Woo Han ,  Dong Woon Chang ,  Joun Sup Park ,  Chan Yong Jeong

发明人： Jung Aun LEE ,  Myeong Woo Han ,  Dong Woon Chang ,  Joun Sup Park ,  Chan Yong Jeong

IPC分类号： H01Q1/38

CPC分类号： H01Q9/045 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15192 ,  H01L2924/19106 ,  H01Q21/065

摘要： There is provided an RF module performing radio communications and allowing for a significantly reduced distance between an antenna and a semiconductor chip. To this end, the RF module includes a semiconductor chip; and a substrate including an anntenna unit formed by a circuit pattern thereon, and having a surface on which the semiconductor chip is mounted to be electrically connected to the antenna unit.

摘要翻译： 提供了RF模块执行无线电通信并且允许天线和半导体芯片之间的距离显着减小。 为此，RF模块包括半导体芯片; 以及包括由其上的电路图案形成的天线单元的基板，并且具有安装半导体芯片以与天线单元电连接的表面。

公开(公告)号：US09397403B2

公开(公告)日：2016-07-19

申请号：US13333398

申请日：2011-12-21

申请人： Myeong Woo Han ,  Jung Aun Lee

发明人： Myeong Woo Han ,  Jung Aun Lee

IPC分类号： H01Q21/00 ,  H01Q9/16 ,  H01Q9/06 ,  H01Q9/28

CPC分类号： H01Q9/16 ,  H01Q9/065 ,  H01Q9/28

摘要： There is provided a dipole antenna. The dipole antenna according to embodiments of the present invention includes: a substrate having a predetermined dielectric constant; and an antenna unit including at least one pair of electrodes and feed lines disposed on one surface of the substrate, wherein the electrodes receive current through the feed lines to generate a signal radiated in a direction in parallel with the one surface of the substrate.

摘要翻译： 提供偶极子天线。 根据本发明的实施例的偶极天线包括：具有预定介电常数的衬底; 以及天线单元，其包括设置在所述基板的一个表面上的至少一对电极和馈电线，其中所述电极接收通过所述馈电线的电流，以产生沿与所述衬底的所述一个表面平行的方向辐射的信号。

公开(公告)号：US20130169376A1

公开(公告)日：2013-07-04

申请号：US13420267

申请日：2012-03-14

申请人： Myeong Woo Han ,  Jung Aun Lee ,  Kook Joo Lee ,  Moonil Kim

发明人： Myeong Woo Han ,  Jung Aun Lee ,  Kook Joo Lee ,  Moonil Kim

IPC分类号： H01P5/10

CPC分类号： H01P5/10

摘要： There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.

摘要翻译： 提供了一种差模放大器驱动电路，包括：第一端口，其一端连接到单个信号; 第二端口，其一端连接到差分信号; 一端接地的第一传输线; 以及第三端口，其一端连接到第一传输线，另一端连接到差分信号。

公开(公告)号：US20130127669A1

公开(公告)日：2013-05-23

申请号：US13362776

申请日：2012-01-31

申请人： Myeong Woo Han ,  Jung Aun Lee ,  Nam Heung Kim

发明人： Myeong Woo Han ,  Jung Aun Lee ,  Nam Heung Kim

IPC分类号： H01Q9/04

CPC分类号： H01Q9/0485

摘要： There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.

摘要翻译： 提供一种电介质天线，包括：多层基板，其具有形成在其预定表面的至少一部分中的开口; 插入所述多层基板中的电介质腔，以通过所述开口辐射电磁波信号; 馈电线馈送电介质腔; 以及至少一个金属图案，其形成在介电腔的内部或其表面上，从而与馈电线电磁耦合。