Invention Grant
US08736050B2 Front side copper post joint structure for temporary bond in TSV application
有权
前端铜柱接头结构，用于TSV应用中的临时粘结
- Patent Title: Front side copper post joint structure for temporary bond in TSV application
- Patent Title (中): 前端铜柱接头结构，用于TSV应用中的临时粘结
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Application No.: US12831819Application Date: 2010-07-07
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Publication No.: US08736050B2Publication Date: 2014-05-27
- Inventor: Hon-Lin Huang , Ching-Wen Hsiao , Kuo-Ching Hsu , Chen-Shien Chen
- Applicant: Hon-Lin Huang , Ching-Wen Hsiao , Kuo-Ching Hsu , Chen-Shien Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An integrated circuit structure includes a semiconductor substrate; a conductive via (TSV) passing through the semiconductor substrate; and a copper-containing post overlying the semiconductor substrate and electrically connected to the conductive via.
Public/Granted literature
- US20110049706A1 Front Side Copper Post Joint Structure for Temporary Bond in TSV Application Public/Granted day:2011-03-03
Information query
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