Invention Grant
- Patent Title: Semiconductor package substrate
- Patent Title (中): 半导体封装基板
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Application No.: US13308441Application Date: 2011-11-30
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Publication No.: US08736077B2Publication Date: 2014-05-27
- Inventor: Jong Man Kim , Young Hoon Kwak , Kyu Hwan Oh , Seog Moon Choi , Tae Hoon Kim
- Applicant: Jong Man Kim , Young Hoon Kwak , Kyu Hwan Oh , Seog Moon Choi , Tae Hoon Kim
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Bracewell & Giuliani LLP
- Agent Brad Y. Chin
- Priority: KR10-2011-0079672 20110810
- Main IPC: H01L23/488
- IPC: H01L23/488
Abstract:
Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.
Public/Granted literature
- US20130037967A1 SEMICONDUCTOR PACKAGE SUBSTRATE Public/Granted day:2013-02-14
Information query
IPC分类:
