发明授权
US08736079B2 Pad structure, circuit carrier and integrated circuit chip 有权
垫结构,电路载体和集成电路芯片

Pad structure, circuit carrier and integrated circuit chip
摘要:
A pad structure is suitable for a circuit carrier or an integrated circuit chip. The pad structure includes an inner pad, a conductive via and an outer pad. The conductive via connects the inner pad. The outer pad connects the conductive via and further connects a conductive ball or a conductive bump. The outer diameter of the outer pad is greater than the outer diameter of the inner pad.
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