发明授权
- 专利标题: Pad structure, circuit carrier and integrated circuit chip
- 专利标题(中): 垫结构,电路载体和集成电路芯片
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申请号: US13190486申请日: 2011-07-26
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公开(公告)号: US08736079B2公开(公告)日: 2014-05-27
- 发明人: Yu-Kai Chen , Yeh-Chi Hsu
- 申请人: Yu-Kai Chen , Yeh-Chi Hsu
- 申请人地址: TW New Taipei
- 专利权人: VIA Technologies, Inc.
- 当前专利权人: VIA Technologies, Inc.
- 当前专利权人地址: TW New Taipei
- 代理机构: Jianq Chyun IP Office
- 优先权: TW100117982A 20110523
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L23/52 ; H01L29/40
摘要:
A pad structure is suitable for a circuit carrier or an integrated circuit chip. The pad structure includes an inner pad, a conductive via and an outer pad. The conductive via connects the inner pad. The outer pad connects the conductive via and further connects a conductive ball or a conductive bump. The outer diameter of the outer pad is greater than the outer diameter of the inner pad.
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