发明授权
- 专利标题： Electronic device housing and manufacturing method thereof
- 专利标题（中）： 电子设备外壳及其制造方法
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申请号： US12965856申请日： 2010-12-11
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公开(公告)号： US08737045B2公开(公告)日： 2014-05-27
- 发明人: Bin Dai , Fa-Guang Shi
- 申请人： Bin Dai , Fa-Guang Shi
- 申请人地址： CN Shenzhen TW New Taipei
- 专利权人： Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW New Taipei
- 代理机构： Novak Druce Connolly Bove + Quigg LLP
- 优先权： CN201010248392 20100809
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; H05K7/00 ; H05K1/03 ; A47B81/00 ; H01R13/502
摘要：
An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing to form a receiving groove between the bottom housing and the plastic side frame. The plastic side frame is integrally formed by injecting a plastic material in the receiving groove. A manufacturing method for an electronic device housing is also provided.
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