Bonding structure and electronic device using the same
    1.
    发明授权
    Bonding structure and electronic device using the same 有权
    接合结构和电子设备使用相同

    公开(公告)号:US09195266B2

    公开(公告)日:2015-11-24

    申请号:US13632275

    申请日:2012-10-01

    IPC分类号: H05K5/00 H05K7/00 G06F1/16

    CPC分类号: G06F1/1626 Y10T428/13

    摘要: A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface, the second connecting part further includes positioning members in the bonding groove. The adhesive is received in the bonding groove of the second connecting part, then the first connecting part is received in the bonding groove. The first joining surface is supported by the positioning members to position the first connecting part, the adhesive is located between the first joining surface and a bottom of the bonding groove to join the first and the second connecting part together. The present disclosure further discloses an electronic device using the bonding structure.

    摘要翻译: 接合结构包括第一连接部分,第二连接部分和粘合剂。 第一连接部分包括顶表面和与顶表面相对的第一接合表面。 第二连接部分包括安装表面并且在安装表面上限定了接合槽,第二连接部分还包括接合槽中的定位构件。 粘合剂被接收在第二连接部的接合槽中,然后第一连接部被容纳在接合槽中。 第一接合面被定位构件支撑以定位第一连接部分,粘合剂位于接合槽的第一接合表面和底部之间,以将第一和第二连接部分接合在一起。 本公开进一步公开了一种使用该接合结构的电子设备。

    Lens module and electronic device using the same
    2.
    发明授权
    Lens module and electronic device using the same 失效
    镜头模块和使用其的电子设备

    公开(公告)号:US08749900B2

    公开(公告)日:2014-06-10

    申请号:US13301874

    申请日:2011-11-22

    IPC分类号: G02B7/02

    CPC分类号: G02B7/02 G03B17/12

    摘要: An electronic device using a lens module is disclosed. The lens module for a housing, comprises a barrel comprising a containing portion; and at least one lens insert molded mounted in the containing portion; wherein the containing portion comprises an inner sidewall, and a first latching portion in the inner sidewall; the at least one lens comprises a main body, and a second latching portion extends outward from a side surface of the main body; the second latching portion is received in the first latching portion.

    摘要翻译: 公开了一种使用透镜模块的电子设备。 一种用于壳体的透镜模块,包括一个包含容纳部分的筒体; 以及安装在所述容纳部中的至少一个透镜嵌入件; 其中所述容纳部分包括内侧壁,以及在所述内侧壁中的第一闭锁部分; 所述至少一个透镜包括主体,并且第二闩锁部分从主体的侧表面向外延伸; 第二闩锁部分被容纳在第一闩锁部分中。

    Electronic device frame
    3.
    发明授权
    Electronic device frame 失效
    电子设备框架

    公开(公告)号:US08656618B2

    公开(公告)日:2014-02-25

    申请号:US12965854

    申请日:2010-12-11

    申请人: Bin Dai Fa-Guang Shi

    发明人: Bin Dai Fa-Guang Shi

    IPC分类号: A47G1/06 A47G1/10 A47G1/08

    CPC分类号: H05K5/0017 H04M1/0266

    摘要: A frame of an electronic device is a closed frame, and made of plastic material. The frame defines one or more deformation grooves at the corners of the frame to be expanded out or inwardly narrowed for changing a size of the frame. The frame includes a positioning portion and a support portion extending from an inner surface of the positioning portion. The deformation grooves are defined in the support portion.

    摘要翻译: 电子设备的框架是封闭的框架,由塑料材料制成。 框架在框架的角部处限定一个或多个变形槽,以扩展出或向内变窄以改变框架的尺寸。 框架包括定位部分和从定位部分的内表面延伸的支撑部分。 变形槽被限定在支撑部分中。

    BONDING STRUCTURE AND ELECTRONIC DEVICE USING THE SAME
    4.
    发明申请
    BONDING STRUCTURE AND ELECTRONIC DEVICE USING THE SAME 有权
    使用相同的结合结构和电子设备

    公开(公告)号:US20130107432A1

    公开(公告)日:2013-05-02

    申请号:US13632275

    申请日:2012-10-01

    IPC分类号: H05K7/00 B32B1/04

    CPC分类号: G06F1/1626 Y10T428/13

    摘要: A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface, the second connecting part further includes positioning members in the bonding groove. The adhesive is received in the bonding groove of the second connecting part, then the first connecting part is received in the bonding groove. The first joining surface is supported by the positioning members to position the first connecting part, the adhesive is located between the first joining surface and a bottom of the bonding groove to join the first and the second connecting part together. The present disclosure further discloses an electronic device using the bonding structure.

    摘要翻译: 接合结构包括第一连接部分,第二连接部分和粘合剂。 第一连接部分包括顶表面和与顶表面相对的第一接合表面。 第二连接部分包括安装表面并且在安装表面上限定了接合槽,第二连接部分还包括接合槽中的定位构件。 粘合剂被接收在第二连接部的接合槽中,然后第一连接部被容纳在接合槽中。 第一接合面被定位构件支撑以定位第一连接部分,粘合剂位于接合槽的第一接合表面和底部之间,以将第一和第二连接部分接合在一起。 本公开进一步公开了一种使用该接合结构的电子设备。

    INTERNAL STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME
    5.
    发明申请
    INTERNAL STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME 审中-公开
    用于电子设备的内部结构和使用该电子设备的电子设备

    公开(公告)号:US20130050915A1

    公开(公告)日:2013-02-28

    申请号:US13303141

    申请日:2011-11-23

    IPC分类号: H05K5/00 H05K7/18

    CPC分类号: G06F1/1658

    摘要: An internal structure for an electronic device includes a fixed frame, and a plurality of magnetic assemblies. A plurality of mounting portions are defined in the inner wall of the fixed frame. Each magnetic assembly includes a magnetic member and an elastic element. Both the magnetic member and the elastic element are assembled in the mounting portion. The magnetic member is sandwiched between the inner wall of the fixed frame and the elastic element.

    摘要翻译: 电子设备的内部结构包括固定框架和多个磁性组件。 多个安装部分限定在固定框架的内壁中。 每个磁性组件包括磁性构件和弹性元件。 磁性构件和弹性元件都组装在安装部分中。 磁性构件被夹在固定框架的内壁和弹性元件之间。

    ELECTRONIC DEVICE
    6.
    发明申请
    ELECTRONIC DEVICE 失效
    电子设备

    公开(公告)号:US20110291955A1

    公开(公告)日:2011-12-01

    申请号:US12848345

    申请日:2010-08-02

    IPC分类号: G06F3/041 H05K7/00

    CPC分类号: G06F1/1626

    摘要: An electronic device includes a housing, at least two elastic latching members, an inner frame received in the housing, and at least two fixing members. The housing defines at least two locking portions, the inner frame defines at least two fixing portions, the at least two elastic latching members are fixed to the corresponding fixing portions by the fixing members, and each of the elastic latching members protrudes from the corresponding fixing portion and is latched with the corresponding locking portions.

    摘要翻译: 电子设备包括壳体,至少两个弹性闭锁构件,容纳在壳体中的内框架和至少两个固定构件。 壳体限定至少两个锁定部分,内框架限定至少两个固定部分,所述至少两个弹性闩锁部件通过固定部件固定到相应的固定部分,并且每个弹性闩锁部件从相应的固定件 并且与相应的锁定部分锁定。

    Electronic device housing assembly and manufacturing method thereof
    7.
    发明授权
    Electronic device housing assembly and manufacturing method thereof 失效
    电子器件外壳组件及其制造方法

    公开(公告)号:US08659497B2

    公开(公告)日:2014-02-25

    申请号:US13163871

    申请日:2011-06-20

    IPC分类号: H01Q1/42

    摘要: A housing assembly includes an outer housing, a support member, an antenna cover, a foam member, and an adhesive member. The outer housing defines an antenna opening. The support member is positioned in the outer housing, and encloses the antenna opening. The support member defines a receiving portion for receiving an antenna module, and the receiving portion is aligned with the antenna opening. The antenna cover is positioned in the antenna opening. Both of the foam member and the adhesive member are positioned between the support member and the antenna cover, and the foam member surrounds the adhesive member. The adhesive member connects or fixes the antenna cover to the support member. A method of manufacturing the housing assembly is also provided.

    摘要翻译: 壳体组件包括外壳,支撑构件,天线罩,泡沫构件和粘合构件。 外壳限定天线开口。 支撑构件定位在外壳中,并且包围天线开口。 支撑构件限定用于接收天线模块的接收部分,并且接收部分与天线开口对准。 天线盖位于天线开口中。 泡沫构件和粘合构件都位于支撑构件和天线盖之间,并且泡沫构件围绕着粘合构件。 粘合构件将天线盖连接或固定到支撑构件。 还提供了制造壳体组件的方法。

    Housing and portable electronic device using the same
    8.
    发明授权
    Housing and portable electronic device using the same 失效
    外壳和便携式电子设备使用相同

    公开(公告)号:US08456824B2

    公开(公告)日:2013-06-04

    申请号:US13185665

    申请日:2011-07-19

    申请人: Fa-Guang Shi

    发明人: Fa-Guang Shi

    IPC分类号: H05K5/00 H05K7/00 G09G5/00

    CPC分类号: G06F1/1656

    摘要: A portable electronic device includes a housing and a display mounted onto the housing. The housing includes a bottom wall, a peripheral wall extending from the bottom wall, and a support wall extending from the peripheral wall, along a direction parallel to the bottom wall. The support wall has a top surface, and forms a receiving space together with the peripheral wall and the bottom wall cooperatively. The top surface of the support wall defines a receiving slot surrounding the receiving space. The display is mounted on the housing, and received within the receiving slot of the support wall, to align with the top surface of the support wall of the housing. The support wall further comprises a plurality of buffer slots defined in a bottom surface of the receiving slot and positioned at the corners of the housing.

    摘要翻译: 便携式电子设备包括壳体和安装在壳体上的显示器。 壳体包括底壁,从底壁延伸的周壁和沿着平行于底壁的方向从周壁延伸的支撑壁。 支撑壁具有顶表面,并且与周壁和底壁协同地形成容纳空间。 支撑壁的顶表面限定围绕接收空间的接收槽。 显示器安装在壳体上并且被容纳在支撑壁的接收槽内,以与壳体的支撑壁的顶表面对齐。 支撑壁还包括限定在接收槽的底表面中并且定位在壳体的角部处的多个缓冲槽。

    ELECTRONIC DEVICE WITH THERMOELECTRIC CELL MODULE
    9.
    发明申请
    ELECTRONIC DEVICE WITH THERMOELECTRIC CELL MODULE 审中-公开
    具有热电池模块的电子设备

    公开(公告)号:US20130108893A1

    公开(公告)日:2013-05-02

    申请号:US13368612

    申请日:2012-02-08

    摘要: An electronic device includes a bottom housing, a heat-generating component placed on the bottom housing, and a thermoelectric cell module placed on the bottom housing and corresponding to the heat-generating component. The thermoelectric cell module includes a first thermoelectric sheet sensing a temperature of the heat-generating component, a second thermoelectric sheet sensing a temperature of the bottom housing, and a conductive member electrically connecting the first thermoelectric sheet and the second thermoelectric sheet.

    摘要翻译: 电子装置包括底壳体,放置在底壳体上的发热部件和放置在底壳体上并对应于发热部件的热电电池模块。 热电池模块包括感测发热部件的温度的第一热电板,感测底部壳体的温度的第二热电板,以及电连接第一热电板和第二热电板的导电部件。

    BONDING STRUCTURE
    10.
    发明申请
    BONDING STRUCTURE 审中-公开
    结合结构

    公开(公告)号:US20130084431A1

    公开(公告)日:2013-04-04

    申请号:US13534213

    申请日:2012-06-27

    IPC分类号: B32B3/10 B32B37/00 B32B38/10

    摘要: A bonding structure includes a first connecting body, an adhesive, and a second connecting body. The first connecting body has a bonding surface subject to one or more recessed grooves. The second connecting body is bonded to the bonding surface of the first connecting body by the adhesive. The bonding surface of the first connecting body defines an adhesive receiving groove, the adhesive is received in the adhesive receiving groove and bonds with the second connecting body; the adhesive receiving groove defines an initial adhesive receiving portion recessed from a bottom surface of a portion of the adhesive receiving groove; the initial adhesive receiving portion is for receiving injected adhesive, a depth of the initial adhesive receiving portion is slightly greater than that of the adhesive receiving groove to allow flow and expansion of the glue into the adhesive receiving groove when external force to bond is applied.

    摘要翻译: 接合结构包括第一连接体,粘合剂和第二连接体。 第一连接体具有经受一个或多个凹槽的接合表面。 第二连接体通过粘合剂结合到第一连接体的接合表面。 第一连接体的接合表面限定粘合剂接收槽,粘合剂容纳在粘合剂接收槽中并与第二连接体结合; 粘合剂容纳槽限定从粘合剂容纳槽的一部分的底表面凹陷的初始粘合剂接收部分; 初始粘合剂接收部分用于接收注入的粘合剂,初始粘合剂接收部分的深度稍微大于粘合剂接收槽的深度,以允许当施加外力作用时胶水流入和膨胀到粘合剂接收槽中。