Invention Grant
- Patent Title: Thin overlay mark for imaging based metrology
- Patent Title (中): 用于基于成像的计量学的薄叠加标记
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Application No.: US13964789Application Date: 2013-08-12
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Publication No.: US08741668B1Publication Date: 2014-06-03
- Inventor: Mark Ghinovker
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01R31/06

Abstract:
A thin overlay structure for use in imaging based metrology is disclosed. The thin overlay structure may include a first structure and second structure, the first and second structures designed to have a common center of symmetry, both structures being invariant to a 180 degree rotation about the common center of symmetry, wherein a mark region defining the extent of the structures is characterized by a first direction and a second direction orthogonal to the first direction, a length of the mark region along the first direction being greater than a length of the mark region along the second direction.
Information query
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