发明授权
- 专利标题： Backplate interconnect with integrated passives
- 专利标题（中）： 带集成无源器件的背板互连
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申请号： US13229561申请日： 2011-09-09
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公开(公告)号： US08742570B2公开(公告)日： 2014-06-03
- 发明人: Ravindra V. Shenoy , Marc Maurice Mignard , Manish Kothari , Clarence Chui
- 申请人： Ravindra V. Shenoy , Marc Maurice Mignard , Manish Kothari , Clarence Chui
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM MEMS Technologies, Inc.
- 当前专利权人： QUALCOMM MEMS Technologies, Inc.
- 当前专利权人地址： US CA San Diego
- 代理机构： Knobbe, Martens, Olson & Bear LLP
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
This disclosure provides systems, methods and apparatus for manufacturing display devices having electronic components mounted within a display device package. In one aspect, the electronic component connects to the exterior of the display device through pads that run below a seal that holds a substrate and a backplate of the display device together. In another aspect the electronic components also connect to an electromechanical device within the display device, as well as connecting to pads that are external to the display device.
公开/授权文献
- US20130063415A1 BACKPLATE INTERCONNECT WITH INTEGRATED PASSIVES 公开/授权日：2013-03-14
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